EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
MPN: EPM2210GF324C5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.25 | $202.50 |
| 100 | $17.8 | $1,780.00 |
| 500 | $15.4 | $7,700.00 |
| 1,000 | $13.6 | $13,600.00 |
Drop-in alternatives for EPM2210GF324C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM2210F324I8N
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View Datasheet →EPM2210F324C3N
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View Datasheet →EPM2210GF324C5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Name | EPM2210 |
| Logic Elements (LE) | 2,210 |
| Equivalent Macrocells | 1,700 |
| Maximum User I/Os | 272 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) |
| Internal Performance | 304 MHz |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 6-layer-metal flash, 0.18 um |
| Operating Junction Temperature | 0C to +85C (commercial) |
| Package | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| In-System Programmability | JTAG (IEEE 1149.1) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) |
EPM2210GF324C5 Pin Configuration
| Pin A1 | I/O — General purpose user I/O (bank 1) |
| Pin A2 | I/O — General purpose user I/O (bank 1) |
| Pin B1 | I/O — General purpose user I/O (bank 1) |
| Pin B2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin D3 | GND — Ground reference for bank 1 |
| Pin E5 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin E6 | TMS — JTAG test mode select |
| Pin F5 | TDI — JTAG test data in |
| Pin F6 | TDO — JTAG test data out |
| Pin GND_PAD | GND — Center ground pad - thermal and electrical ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210GF324C5 is suitable for 6 applications: I/O Expansion and Bus Bridging, Power-Up Sequencing Logic, Glue Logic Replacement in Embedded Processor Designs, LED Display and Signage Drivers, Industrial Control and Factory Automation, Configuration Control for Multi-Rail Power Systems.
I/O Expansion and Bus Bridging
The EPM2210GF324C5 is a strong fit for I/O expansion and bus bridging because its 2,210 logic elements and 272 max user I/Os in the 324-ball BGA provide enough capacity to bridge wide processor buses (e.g., 32-bit local bus, 16-bit EMIF) without external transceivers. Its MultiVolt I/O supports direct 1.5/1.8/2.5/3.3 V interfacing, so the same chip can sit between a 3.3 V MCU and 1.8 V peripherals without level shifters. The 5 ns pin-to-pin delay (tPD1) is well within the setup/hold budget of most asynchronous peripheral buses. Designers typically place the CPLD adjacent to the processor with matched-impedance traces on each side; a downside is that the 1.0 mm BGA pitch demands careful escape routing on at least a 4-layer PCB.
Recommended
Power-Up Sequencing Logic
The EPM2210GF324C5 excels at multi-rail power-up sequencing because its non-volatile flash-based configuration makes the device instantly active at power-on (no external configuration flash or boot delay), with deterministic 5 ns pin-to-pin delays for rail timing. The 8-Kbit UFM can hold rail-order tables, and the MultiVolt I/O can drive discrete enable pins of multiple DC-DC converters directly (1.8/2.5/3.3 V tolerant). Compared to an MCU-based sequencer, the CPLD needs no firmware boot time and no watchdog supervisor. Place the CPLD near the regulator enables, route short dedicated traces, and use the JTAG port for in-system update of the rail sequence table when designs evolve.
Recommended
Glue Logic Replacement in Embedded Processor Designs
The EPM2210GF324C5 replaces dozens of 74-series discrete glue-logic packages (LVC, HC, FCT) with one chip, saving board area, BOM count, and routing complexity. With 2,210 LE it can absorb wide address decoders, chip-select generators, wait-state inserters, interrupt muxes, and watchdog timers that would otherwise consume 8-15 discrete packages. The 5 ns propagation delay is comparable to or faster than discrete logic families, and the non-volatility eliminates the cold-start race conditions that plague discrete RC-delay designs. The 324-ball BGA exposes up to 272 user I/Os - enough for full 32-bit address + 32-bit data decoding plus control signal muxing. JTAG ISP allows field updates when logic needs evolve.
Recommended
LED Display and Signage Drivers
The EPM2210GF324C5 is suitable for large LED display row/column drivers because its 272 max user I/Os and MultiVolt compatibility match the wide parallel data buses typical of LED matrix scanning. The 5 ns tPD1 enables scan rates high enough for PWM dimming without visible flicker. The non-volatile configuration means displays come up in the correct pattern at power-on without external boot memory. The industrial-grade variants (EPM2210F324I8N) extend operation to outdoor signage temperature ranges (-40C to +100C). The 8 Kbit UFM can hold gamma correction tables or display calibration data accessible at runtime.
Recommended
Industrial Control and Factory Automation
The EPM2210GF324C5 supports industrial control applications such as PLC I/O conditioning, motor-control peripheral interfacing, and safety-logic gating, where its deterministic 5 ns delay and non-volatile boot are critical. MultiVolt I/O interfaces to 24 V-tolerant field-side logic via external optos, and the JTAG port enables in-field firmware updates through ISP. The 2,210 LE capacity is enough to implement encoder decoding (quadrature, SSI), PWM generation, and interlock logic in a single chip. Industrial temperature grade variants (I8) extend the operating range to -40C to +100C junction. Designers should note that the 1.0 mm BGA requires careful PCB stack-up and may not be suitable for all factory-floor conformal-coated assemblies.
Recommended
Configuration Control for Multi-Rail Power Systems
The EPM2210GF324C5 functions as a power-system configuration controller by storing rail-up sequences, fault-recovery behaviors, and PMBus-style state machines in its 8-Kbit UFM, while its 272 I/Os drive FET gates, OR-ing controller enables, and hot-swap FET controls. The 5 ns pin-to-pin delay suits sub-microsecond fault response required for hot-swap and OR-ing applications. Non-volatile boot means the power system starts in a known-good state without CPU firmware intervention, critical during brown-out or cold-start events. The 1.8 V core and MultiVolt I/O eliminate the need for separate level translators across mixed-voltage power rails. Compared to MCU solutions, the CPLD has deterministic timing and zero firmware boot time.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210GF324C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F324I8N | EPM2210F324C3N | EPM2210GF324C4N | EPM1270F256C5N |
|---|---|---|---|---|---|
| Package | 324-ball FineLine BGA (GF324), 1.0 mm pitch | 324-ball FineLine BGA (F324) - same footprint | 324-ball FineLine BGA (F324) - same footprint | 324-ball FineLine BGA (GF324) - same footprint | 256-ball FineLine BGA (F256) - smaller footprint |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 2,210 LE | 2,210 LE (same) | 2,210 LE (same) | 2,210 LE (same) | 1,270 LE (-43%) |
| Speed Grade (tPD1) | 5 ns (C5) | 8 ns (I8) - slower, industrial temp | 3 ns (C3) - faster | 4 ns (C4) - faster | 5 ns (C5) - same |
| Operating Temperature | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same - MAX II family UFM) |
| Max User I/Os | 272 | 272 (same) | 272 (same) | 272 (same) | 212 (smaller package) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) |
| Lifecycle Status (2026) | Last-Time-Buy | Last-Time-Buy (same family) | Last-Time-Buy (same family) | Last-Time-Buy (same family) | Last-Time-Buy (same family) |
Key Differentiators
- Highest-density MAX II device with 2,210 LE (vs EPM1270F256C5N)
- Non-volatile flash configuration (instant-on) (vs SRAM-based small FPGAs (e.g., Cyclone IV))
- 324-ball FineLine BGA exposes 272 user I/Os (vs EPM1270F256C5N (256-ball BGA))
- MultiVolt I/O supports 1.5/1.8/2.5/3.3 V directly (vs MAX 3000A legacy CPLDs (single 3.3 V I/O))
Design Notes
The EPM2210GF324C5 is a 324-ball FineLine BGA with 1.0 mm pitch. PCB layout must use via-in-pad or microvia escape routing, with at least 4 layers (signal-ground-power-signal). The center ground pad (GND_PAD) must be soldered to a large copper pad connected to the ground plane for both thermal dissipation and electrical reference. Use NSMD (non-solder mask defined) pads and a reflow profile compatible with large fine-pitch BGAs (ramp 1-3 C/s, peak 235-245 C for SAC305 paste). Stencil aperture should be 1:1 to pad for signal balls and slightly reduced (90%) for the thermal/ground pad to avoid solder starvation.
Provide separate decoupling for VCCINT (1.8 V core) and each VCCIO bank (1.5/1.8/2.5/3.3 V). Place 0.1 uF X7R ceramic capacitors as close as possible to each VCC pin (one cap per VCC ball or per VCCIO bank), with a bulk 10 uF tantalum or ceramic per supply rail. Estimated: a fully utilized 2210-LE design with 200 MHz toggle rate draws roughly 100-200 mA from VCCINT and 50-150 mA from VCCIO banks; verify against actual utilization in Quartus II PowerPlay. Power sequencing between VCCINT and VCCIO is not required (MultiVolt allows any-order power-up).
Do not leave unused I/O pins floating - configure them in the Quartus II device settings as 'As input tri-stated with weak pull-up' to prevent input oscillation and extra supply current. Ensure the JTAG chain (TCK/TMS/TDI/TDO) is correctly terminated; on boards where the CPLD is not the only JTAG device, include proper TMS pull-ups and TDO-to-TDI daisy-chain routing. The UFM block shares access with configuration logic - if the UFM is read at runtime, ensure the Quartus II design uses the altsyncram or UFM megafunction with proper address mapping to avoid contention.
Estimated: At maximum utilization (100% LE, ~50 MHz toggle, 3.3 V VCCIO), the EPM2210GF324C5 dissipates roughly 0.5-1.0 W. With theta-JA of approximately 20-25 C/W on a standard JEDEC 4-layer test board, junction temperature rise is 10-25 C above ambient. No heatsink is required. However, in sealed industrial enclosures or high-ambient (>70C) environments, monitor case temperature; if it approaches 85C, add thermal vias under the GND_PAD and consider forced airflow.
Compliance Information
RoHS-compliant per Altera/Intel product page. Commercial temperature grade only (0C to +85C). AEC-Q100 not applicable - this is a CPLD, not an automotive-grade IC. Use industrial variant EPM2210F324I8N for -40C to +100C.
