EPM2210GF324C5N vs EPM2210GF324C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324C5N sa pamamagitan ng Intel at EPM2210GF324C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EPM2210GF324C4N EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EPM2210GF324C5N EPM2210GF324C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX II G MAX II
Series MAX II —
Logic Elements 2210 2,210
Equivalent Macrocells 1700 1,700
User Flash Memory (UFM) 8 Kbits 8 Kbits
Maximum User I/O 212 —
Pin-to-Pin Delay (tPD) 11.2 ns —
Propagation Delay 11.2 ns (max) —
Technology Flash CMOS, 6-layer metal —
Core Voltage 3.3 V / 2.5 V (internal) —
I/O Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) —
Packhaging 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch 324-ball FineLine BGA (GF324)
Temperature na Operasyon 0 °C to +85 °C (commercial) —
Uri ng Pagpapasok Surface Mount —
Programmability In-system (JTAG / IEEE 1532), non-volatile —
Lead Free Yes —
Tindminan RoHS Compliant Compliant
Level ng MSL 3 —
Device Type — CPLD (Complex Programmable Logic Device)
User I/Os (max) — 272
Supply Voltage - Core (VCCINT) — 1.8 V
MultiVolt I/O Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V
Maximum Internal Frequency — 247.5 MHz
Pin-to-Pin Logic Delay (tPD) — 7.0 ns (C4 speed grade)
Process Technology — 0.18 µm 6-layer-metal flash
Programming Interface — IEEE 1149.1 JTAG (ISP)
Operating Temperature (commercial) — 0 °C to +85 °C

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita