H58G56AK6QX032N vs H58G66CK8BX147N Comparison
Detailed side-by-side comparison of H58G56AK6QX032N by SK hynix and H58G66CK8BX147N by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H58G56AK6QX032N | H58G66CK8BX147N |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.40 | $34.60 |
| Memory Type | LPDDR5 SDRAM | LPDDR5X SDRAM |
| Density | 32Gb (4GB) | 64 Gbit (8 GB) |
| Organization | 512M x 64 | x8 (single channel) |
| Data Rate | 6400 Mbps per pin | — |
| Bus Width | x16 (x64 variant per sourcing data) | — |
| Core Voltage (VDD) | 0.5 V | — |
| I/O Voltage (VDDQ) | 0.5 V | — |
| Interface Voltage (VDD2) | 1.8 V / 1.05 V | — |
| Package | FBGA-315 | 315-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Grade | Automotive | — |
| Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules | — |
| Standard | JEDEC LPDDR5 | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Reflow/MSL Rating | [DATA_NEEDED: MSL level] | — |
| Maximum Data Rate | — | 8533 Mbps |
| Supply Voltage Domain | — | 0.5 V to 1.8 V |
| Core Voltage Class | — | 1.05 V (LPDDR5/LPDDR5X class) |
| Standard Compliance | — | JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) |
| Interface | — | LPDDR5/LPDDR5X protocol |
| Channel Configuration | — | Single channel (x8 or x16 capable family) |
| Power Management | — | Dynamic voltage and frequency scaling (DVFSC/DVFSQ) |
| Application Domain | — | Smartphone, AI edge, server-class mobile computing |
| Refresh Scheme | — | LPDDR5 per-bank / all-bank refresh |