H58G56AK6QX032N - 32Gb LPDDR5-6400 DRAM, Automotive | SK Hynix
MPN: H58G56AK6QX032N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.2 | $172.00 |
| 100 | $15.8 | $1,580.00 |
| 500 | $14.6 | $7,300.00 |
| 1,000 | $13.4 | $13,400.00 |
Drop-in alternatives for H58G56AK6QX032N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H58G56AK6QX032N Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM |
| Density | 32Gb (4GB) |
| Organization | 512M x 64 |
| Data Rate | 6400 Mbps per pin |
| Bus Width | x16 (x64 variant per sourcing data) |
| Core Voltage (VDD) | 0.5 V |
| I/O Voltage (VDDQ) | 0.5 V |
| Interface Voltage (VDD2) | 1.8 V / 1.05 V |
| Package | FBGA-315 |
| Mounting Type | Surface Mount |
| Grade | Automotive |
| Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
| Standard | JEDEC LPDDR5 |
H58G56AK6QX032N fbga-315 Pin Configuration Guide
Complete pinout information for H58G56AK6QX032N (fbga-315 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H58G56AK6QX032N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H58G56AK6QX032N is suitable for 6 applications: Automotive ADAS Perception Compute, Automotive Infotainment and Cluster, Industrial Computing Modules, Firmware Boot and Embedded Logging, Data Storage Buffering, Consumer and Computing Main Memory.
Automotive ADAS Perception Compute
The H58G56AK6QX032N fits ADAS perception controllers because its 6400 Mbps LPDDR5 interface at x64 width delivers roughly 51.2 GB/s peak bandwidth, sufficient to buffer multi-camera and radar sensor fusion workloads in real time. The automotive positioning of the part supports data storage and embedded logging duties required in vehicle programs. In a typical topology, the part hangs off an ADAS SoC's LPDDR5 controller with two DQ byte-lane groups per die; WCK clocking keeps I/O power low via the 0.5V VDDQ rail. The main trade-off is strict signal-integrity compliance work at 6400 Mbps, requiring length-matched routing and eye-margin validation during bring-up.
Recommended
Automotive Infotainment and Cluster
Digital cockpit and instrument-cluster SoCs need large frame buffers for multi-display output, and the 32Gb (4GB) density of the H58G56AK6QX032N covers dual 1080p-cluster plus center-display scenarios without external buffering. The LPDDR5-6400 rate ensures display refresh and GPU rendering share bandwidth predictably, while the automotive flow suits the qualification expectations of tier-1 cockpit platforms. Typical use: mounted directly under or beside the cockpit SoC on a short, tightly length-matched bus. Because infotainment loads are bursty, LPDDR5's bank-group interleaving sustains efficiency at partial loads; designers should budget refresh overhead and reserve bandwidth headroom of at least 20% for software growth over the vehicle lifecycle.
Recommended
Industrial Computing Modules
Industrial controllers and edge-computing modules adopt LPDDR5 main memory to run vision inspection, protocol translation, and local AI inference. The H58G56AK6QX032N provides 4GB working memory with the low 0.5V VDDQ rail reducing I/O power in sealed, fanless enclosures where thermal budget is tight. Embedded logging and data-storage duties listed for this automotive family also map well to industrial dataloggers. In module designs (COM Express, SMARC class), the DRAM is soldered on-module with the CPU for shock and vibration resistance. Trade-off: LPDDR5 layout rules demand 4+ layer stackups with solid reference planes; budget PCB cost accordingly versus LPDDR4X-based modules.
Recommended
Firmware Boot and Embedded Logging
SK Hynix lists firmware boot and embedded logging among the target duties for this automotive memory family. As main memory, the H58G56AK6QX032N receives boot code copied from NOR flash by the boot ROM, then hosts logging buffers that are flushed to storage. Its 32Gb capacity leaves room for ring-buffer telemetry alongside the application heap in data-recording ECUs. Designers should reserve a protected DDR region for logging in the memory map and validate retention across power-fail events using SoC RAM-retention features. Pairing with a robust NOR or NAND boot device and a supervisor that sequences the 0.5V/1.05V/1.8V rails cleanly avoids corrupted logging after brown-out events.
Recommended
Data Storage Buffering
High-speed data acquisition and storage systems use LPDDR5 as a write-coalescing buffer between fast sensor interfaces and slower persistent media. The H58G56AK6QX032N's 6400 Mbps, x64-wide interface absorbs burst arrivals at up to ~51.2 GB/s theoretical, letting sustained NVMe or UFS write streams drain the buffer at their own pace. Its 4GB capacity provides tens to hundreds of milliseconds of buffering at gigabyte-class ingress rates, protecting against storage stalls. The 0.5V VDDQ keeps buffer-refresh I/O power manageable in dense systems. Design consideration: enable LPDDR5 refresh-aware scheduling in the DMA engine so logging throughput does not collapse during tRFC windows.
Recommended
Consumer and Computing Main Memory
Beyond automotive, the H58G56AK6QX032 family serves consumer electronics and computing systems as main memory, as reflected in distributor positioning for mobile devices and computing platforms. A 32Gb x64 LPDDR5 device at 6400 Mbps suits tablets, smart displays, and embedded x86/ARM boards needing 4GB in a single package, halving component count versus two 16Gb parts. The FBGA-315 footprint keeps routing compact on 6-8 layer consumer boards. For consumer cost-optimized designs where the automotive premium is unnecessary, verify the commercial equivalent speed grade before committing, since this QX032 automotive part may carry price overhead relative to standard-consumer LPDDR5 bins.
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Recommended Products Summary
Engineering reference data for H58G56AK6QX032N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H58G56AK6QX032 | H58G56AK6PX032 | H58G46AK6QX033 | MT53E2G64D8TN-046 |
|---|---|---|---|---|---|
| Package | FBGA-315 | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same | FBGA (different ball-map - verify) |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Memory Type | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Density | 32Gb (4GB) | 32Gb | 32Gb | 24Gb (3GB) | 16Gb (2GB) |
| Organization | 512M x 64 | 512M x 64 | 512M x 64 | 384M x 64 class | 2G x 64 |
| Data Rate | 6400 Mbps | 6400 Mbps | 6400 Mbps class | 6400 Mbps class | 4600 Mbps |
| Voltage Rails | 0.5 V / 1.05 V / 1.8 V | 0.5 V / 1.05 V / 1.8 V | 0.5 V / 1.05 V / 1.8 V | 0.5 V / 1.05 V / 1.8 V | LPDDR5 rail set (verify per datasheet) |
| Grade | Automotive | Automotive | Automotive (verify bin) | Automotive | Commercial |
| Price (qty 1, as of 2026-09-05) | 18.50 USD | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Full 32Gb (4GB) density in a single package (vs H58G46AK6QX033)
- Higher sustained data rate than cross-brand commercial alternatives (vs MT53E2G64D8TN-046)
- Automotive positioning with traceability (vs H58G56AK6PX032)
Design Notes
At 6400 Mbps, LPDDR5 leaves little SI margin. Keep CA/DQ/WCK trace-length mismatch within controller spec (typically a few mils per group), route over unbroken reference planes, and minimize via stubs with back-drilling on thick boards. Use SK Hynix and controller-vendor IBIS-AMI models in pre-layout simulation, then perform read/write eye-margin tests at temperature corners during bring-up. Budget a 10-15% derating margin against the 6400 Mbps grade for production variation and aging.
The H58G56AK6QX032N uses three rails: 0.5V VDD/VDDQ, 1.05V, and 1.8V. Sequence them per the datasheet power-up procedure and use a PMIC with LPDDR5 sequencing support. The 0.5V rail carries high transient I/O currents, so place bulk plus high-frequency ceramic decoupling directly at the VDDQ balls; target milliohm-level PDN impedance in the 100 MHz region. Estimated: at 64-bit x 6400 Mbps with high toggle rates, I/O current can reach multiple amps peak - verify with the controller vendor's power estimator.
LPDDR5 firmware init differs from LPDDR4X: mode-register programming, WCK sync, and training (read/write leveling, CA training, DQS oscillator) must match the exact speed bin shipped. When substituting within the same family (QX032/PX032 variants), re-verify JEDEC ID reads and re-run training tables in bootloader updates. Do not assume cross-brand (e.g., Micron MT53) parts share the same ball-map - cross-brand substitution is a board redesign, not a drop-in swap.
Compliance Information
Automotive positioning is stated in sourcing data, but no explicit AEC-Q100, RoHS, or REACH certificates were found in the provided web data; confirm with SK Hynix before production release.
