H58G56AK6QX032N vs H58G66CK8BX147N 对比
详细并排对比 H58G56AK6QX032N 出自 SK hynix 和 H58G66CK8BX147N 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H58G56AK6QX032N | H58G66CK8BX147N |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $13.40 | $34.60 |
| 存储器类型 | LPDDR5 SDRAM | LPDDR5X SDRAM |
| Density | 32Gb (4GB) | 64 Gbit (8 GB) |
| 存储组织 | 512M x 64 | x8 (single channel) |
| 数据速率 | 6400 Mbps per pin | — |
| Bus Width | x16 (x64 variant per sourcing data) | — |
| Core Voltage (VDD) | 0.5 V | — |
| I/O Voltage (VDDQ) | 0.5 V | — |
| Interface Voltage (VDD2) | 1.8 V / 1.05 V | — |
| 封装 | FBGA-315 | 315-ball FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Grade | Automotive | — |
| Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules | — |
| Standard | JEDEC LPDDR5 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Reflow/MSL Rating | [DATA_NEEDED: MSL level] | — |
| Maximum Data Rate | — | 8533 Mbps |
| Supply Voltage Domain | — | 0.5 V to 1.8 V |
| Core Voltage Class | — | 1.05 V (LPDDR5/LPDDR5X class) |
| Standard Compliance | — | JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) |
| 接口 | — | LPDDR5/LPDDR5X protocol |
| Channel Configuration | — | Single channel (x8 or x16 capable family) |
| Power Management | — | Dynamic voltage and frequency scaling (DVFSC/DVFSQ) |
| Application Domain | — | Smartphone, AI edge, server-class mobile computing |
| Refresh Scheme | — | LPDDR5 per-bank / all-bank refresh |