H58G66CK8BX147N vs H58G46AK6QX033 Comparison

Detailed side-by-side comparison of H58G66CK8BX147N by SK hynix and H58G46AK6QX033 by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter H58G66CK8BX147N H58G46AK6QX033
Brand SK hynix SK hynix
Category Memory ICs Mobile LPDDR4
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $34.60 $9.75
Memory Type LPDDR5X SDRAM LPDDR5 (Low Power Double Data Rate 5) SDRAM
Density 64 Gbit (8 GB) 16Gb (2 GB)
Organization x8 (single channel) x16
Maximum Data Rate 8533 Mbps —
Supply Voltage Domain 0.5 V to 1.8 V —
Core Voltage Class 1.05 V (LPDDR5/LPDDR5X class) —
Package 315-ball FBGA —
Mounting Type Surface Mount Surface Mount (soldered BGA)
Standard Compliance JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) —
Interface LPDDR5/LPDDR5X protocol LPDDR5 (JEDEC)
Channel Configuration Single channel (x8 or x16 capable family) —
Power Management Dynamic voltage and frequency scaling (DVFSC/DVFSQ) —
Application Domain Smartphone, AI edge, server-class mobile computing Automotive ADAS, infotainment, industrial computing
Operating Temperature [DATA_NEEDED: Operating Temperature Range] [DATA_NEEDED: operating temperature range]
Refresh Scheme LPDDR5 per-bank / all-bank refresh —
RoHS Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS compliance status]
Data Rate — 6400 Mbps per pin
Peak Bandwidth — 12.8 GB/s (x16 channel)
Grade — Automotive
Supply Voltage — [DATA_NEEDED: core/I-O supply voltage]
Package Type — FBGA (ball grid array)
Ball Count — [DATA_NEEDED: package ball count]
AEC-Q100 — [DATA_NEEDED: AEC-Q100 qualification level]
Refresh — [DATA_NEEDED: refresh scheme]

Datasheets & Resources

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