H58G46AK6QX033 - LPDDR5-6400 2GB Automotive DRAM | SK Hynix
MPN: H58G46AK6QX033 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.8 | $1,180.00 |
| 500 | $10.6 | $5,300.00 |
| 1,000 | $9.75 | $9,750.00 |
Drop-in alternatives for H58G46AK6QX033 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H58G46AK6QX033 Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 (Low Power Double Data Rate 5) SDRAM |
| Density | 16Gb (2 GB) |
| Organization | x16 |
| Data Rate | 6400 Mbps per pin |
| Peak Bandwidth | 12.8 GB/s (x16 channel) |
| Interface | LPDDR5 (JEDEC) |
| Grade | Automotive |
| Package Type | FBGA (ball grid array) |
| Mounting Type | Surface Mount (soldered BGA) |
| Application Domain | Automotive ADAS, infotainment, industrial computing |
H58G46AK6QX033 fbga (ball grid array) Pin Configuration Guide
Complete pinout information for H58G46AK6QX033 (fbga (ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H58G46AK6QX033.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H58G46AK6QX033 is suitable for 6 applications: Automotive ADAS Domain Controllers, Digital Cockpit and Infotainment, Telematics and Gateway ECUs, Industrial Edge-AI Computing Modules, High-Performance Embedded Logging and Firmware Boot, Automotive Replacement Sourcing and Second Source.
Automotive ADAS Domain Controllers
The H58G46AK6QX033 fits ADAS domain controllers because its LPDDR5-6400 x16 configuration delivers up to 12.8 GB/s of peak bandwidth from a single soldered package, matching the memory demands of camera, radar, and lidar sensor-fusion workloads that stream multi-Gbps of raw data into perception accelerators. Its automotive qualification targets the extended temperature, reliability, and traceability requirements of vehicle ECU programs. In the memory subsystem, the package is placed directly beneath or beside the SoC on a point-to-point LPDDR5 channel with length-matched routing and controller training compensating residual skew. Using one 2 GB (16Gb) package instead of two smaller dies reduces ball-map complexity, trace count, and board area, and the LPDDR5 deep-sleep and DVFS features let the domain controller cut memory power during parking or standby states without losing context.
Recommended
Digital Cockpit and Infotainment
Digital cockpits combine 3D instrument clusters, navigation, and multi-display output, all of which are bandwidth-hungry frame-buffer workloads. The H58G46AK6QX033's 6400 Mbps per-pin rate provides the sustained throughput needed to refresh multiple high-resolution displays while the SoC runs map rendering and voice processing, and its 2 GB x16 organization simplifies the memory rail design in space-constrained head units. The automotive grade designation aligns with the quality expectations of Tier-1 infotainment platforms. On the PCB, the LPDDR5 package mounts within the SoC's reference-design keep-out, using WCK clocking and on-die termination to maintain signal integrity at speed. DVFS allows the cockpit SoC to throttle memory frequency during audio-only modes, reducing EMI and heat inside the dashboard enclosure - a quantified benefit over fixed-frequency LPDDR4X designs.
Recommended
Telematics and Gateway ECUs
Telematics gateways and connected-car ECUs aggregate cellular, V2X, CAN, and Ethernet traffic, buffering bursts of payload and running cybersecurity stacks that benefit from the H58G46AK6QX033's 2 GB of main memory and 12.8 GB/s peak bandwidth. Although these ECUs are less bandwidth-bound than ADAS controllers, the LPDDR5 package's low operating voltage and deep power-down modes suit always-on, ignition-off duty cycles where quiescent battery drain is tightly budgeted. The soldered FBGA format withstands automotive vibration better than socketed memory alternatives. In the design, the memory operates at reduced LPDDR5 frequencies most of the time via DVFS, scaling up only during OTA update downloads or map synchronization, which lowers average power and radio-front-end noise coupling on the shared board.
Recommended
Industrial Edge-AI Computing Modules
Edge-AI modules for machine vision, robotics, and predictive maintenance need dense, low-power soldered DRAM to feed NPUs and GPU clusters. The H58G46AK6QX033 is cited in its product overview for industrial controllers and computing modules, and its 16Gb density in a single package keeps COM (computer-on-module) footprints compact while the LPDDR5-6400 rate sustains real-time inference pipelines. The x16 organization matches many embedded SoC memory controllers natively, avoiding width-conversion overhead. Designers should confirm the industrial ambient temperature against the datasheet's rated range, since the part is binned for automotive platforms. On the module, the FBGA die sits on the primary LPDDR5 channel with 0.5 V-class VDDQ rails; the low-voltage signaling shortens rise times, so strict length matching and uninterrupted reference planes are required to hold the 6400 Mbps eye at production yield.
Recommended
High-Performance Embedded Logging and Firmware Boot
Data loggers, event recorders, and secure boot platforms use DRAM as a high-speed staging buffer between non-volatile storage and the processor. The H58G46AK6QX033's 12.8 GB/s peak bandwidth lets an embedded system snapshot sensor streams or decrypt firmware images far faster than LPDDR4-class memory, shortening boot and logging-latency budgets. The overview explicitly lists embedded logging and firmware boot among its use cases. In these designs, the LPDDR5 package holds the working set while flash (e.g., SK hynix or Micron NAND/NOR) provides persistence; the DRAM's deep-sleep state keeps residual power near zero between events. Automotive qualification is valuable for vehicle event-data recorders, where memory must survive extended temperature swings and power interruptions without corruption of in-flight buffers.
Recommended
Automotive Replacement Sourcing and Second Source
For procurement teams managing long-life automotive programs, the H58G46AK6QX033 serves as a replacement-sourcing target when original memory line items face allocation or EOL risk. With 43,650 pieces listed in stock at Wolfchip (as of Aug 05, 2026) and additional inventory at independent distributors, supply is currently available outside franchise channels. The same SK hynix family parts H58G46AK6PX033 and H58G46AK6PX033N provide binning-level second sources on the identical footprint, allowing qualification with only speed-grade re-verification rather than a PCB respin. Buyers should demand date-code traceability, authenticity inspection, and conformity certificates when purchasing automotive memory through independent distribution, and should file both QX and PX bins on the AVL (approved vendor list) to hedge future market shortages.
Recommended
Recommended Products Summary
Engineering reference data for H58G46AK6QX033 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H58G46AK6PX033 | H58G46AK6PX033N |
|---|---|---|---|
| Package | FBGA | FBGA - same | FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 |
| Density | 16Gb (2 GB) | 16Gb (2 GB) | 16Gb (2 GB) |
| Organization | x16 | x16 | x16 |
| Data Rate | 6400 Mbps | [DATA_NEEDED] verify speed bin | [DATA_NEEDED] verify speed bin |
| Automotive Grade | Yes | Yes | Yes |
| Peak Bandwidth (x16) | 12.8 GB/s | [DATA_NEEDED] depends on speed bin | [DATA_NEEDED] depends on speed bin |
Key Differentiators
- 6400 Mbps speed bin in automotive LPDDR5 (vs H58G46AK6PX033)
- Single-package 2 GB (16Gb) density on x16 (vs two-package 8Gb solutions)
- Automotive qualification tier (vs consumer LPDDR5 (e.g., standard MT53E series))
Design Notes
At 6400 Mbps, LPDDR5 signaling leaves little timing margin. Route CA and DQ buses with tightly controlled lengths per the SoC vendor's LPDDR5 layout guide, maintain continuous reference planes under every byte lane, and match intra-byte skew within the window the controller's training algorithm can absorb. Keep the DRAM within the maximum fly-by/point-to-point trace length budget specified for the speed grade; exceeding it typically forces derating below 6400 Mbps.
LPDDR5 uses low-voltage rails (VDDQ in the 0.5 V class and VDD2 around 1.05 V per the JEDEC generation) with strict ripple tolerances. Estimated: even a 2% rail error on a 0.5 V VDDQ is 10 mV, which can approach the AC noise margin at 6400 Mbps, so use a dedicated PMIC LPDDR5 rail (such as an automotive-grade buck with DDR tracking) and verify sequencing order per the SK hynix datasheet before power-rail sign-off.
Do not assume LPDDR5 packages with equal density are interchangeable across vendors: ball maps and die-revision-specific training requirements differ, and a wrong-ball-map substitution will not boot. Also confirm the SoC memory controller supports the exact speed bin (QX vs PX coding in the H58G46AK6 family) in its verified timing table; using a faster bin than the controller validates only guarantees the controller's lower supported rate, wasting bandwidth headroom.
Compliance Information
Public overview data does not state RoHS/REACH/AEC-Q100 status. Automotive designation is stated in the product overview; formal AEC-Q100 qualification level must be requested from SK hynix.
