H5AN4G8NBJR-PBC vs MT40A512M8RH-083E Comparison

Detailed side-by-side comparison of H5AN4G8NBJR-PBC by SK hynix and MT40A512M8RH-083E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M8RH-083E MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E ✓ Active

Specification Comparison

Parameter H5AN4G8NBJR-PBC MT40A512M8RH-083E
Brand SK hynix Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.20 $3.30
Memory Density 4 Gbit —
Organization 512M x 8 512M x 8
Memory Type DDR4 SDRAM DDR4 SDRAM
Interface Type Parallel, JEDEC DDR4 —
Supply Voltage VDD 1.2 V —
Supply Voltage VDDQ 1.2 V —
Speed Grade PBC —
Clock Frequency [DATA_NEEDED: Clock Frequency] —
CAS Latency (CL) [DATA_NEEDED: CAS Latency] —
Package 78-ball FBGA 78-ball FBGA (9 x 10.5 mm)
Mounting Type Surface Mount —
Normal Operating Case Temperature 0C to 85C —
Extended Temperature Range up to 95C case (with increased refresh) —
Lead Free Yes —
Halogen Free Yes —
Refresh 8n prefetch, standard/auto refresh per DDR4 JEDEC 64 ms, 8192-cycle refresh (to 95C)
Density — 4 Gbit
Industry Speed Grade — DDR4-2400
Clock Rate — 1.2 GHz
Internal Banks — 8 banks (2 groups of 4)
Prefetch — 8n-bit
VDD / VDDQ — 1.2 V +/-60 mV
VPP — 2.5 V, -125 mV/+250 mV
I/O Structure — 1.2 V pseudo open-drain
VREFDQ — On-die internal, adjustable generation
Operating Temperature — 0C to +95C
FBGA Code — D9TGG
Marking Code — D9TGG
Data Strobe Preamble — Programmable
RoHS Status — Compliant
CAS Latency — [DATA_NEEDED: CAS latency per speed bin table]

Datasheets & Resources

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