H5ANAG6NCJR-XN vs H5ANAG6NCR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NCJR-XN by SK hynix and H5ANAG6NCR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter H5ANAG6NCJR-XN H5ANAG6NCR-UHC
Brand SK hynix SK hynix
Category Memory ICs Mobile LPDDR4
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $71.20 $9.20
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 16 Gbit (1G x 16) —
Organization 1G x 16 1G x 16
Data Rate 3200 Mbps/pin (DDR4-3200) —
Supply Voltage (VDD) 1.14 V to 1.26 V [DATA_NEEDED: VDD voltage]
Package FBGA-96 (96-ball) FBGA-96 (PBGA-96)
Package Width 8 mm —
Mounting Type Surface Mount (BGA) Surface Mount
Auto Self-Refresh Yes —
Auto Precharge Yes —
Asynchronous Reset Yes —
Data Mask (DM) Yes —
Dynamic On-Chip Termination (ODT) Yes —
ZQ Calibration Yes —
CRC (Command/Address) Yes —
Write Leveling Yes —
Maximum Standby Current 0.074 A (per Vyrian listing) —
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating temperature range]
CAS Latency [DATA_NEEDED: CAS latency for -XN speed grade] —
Memory Density — 16 Gb (2 GB)
Interface — CMOS, Double Data Rate IV
Die Revision — C
Speed Grade — [DATA_NEEDED: Speed grade / data rate]
Configuration — 1 Channel, 1 Rank
Refresh — [DATA_NEEDED: Refresh scheme]
Factory Packing Quantity — [DATA_NEEDED: Standard packing quantity]
Application — Main memory, embedded computing, industrial controllers

Datasheets & Resources

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