H5ANAG6NCR-UHC - 16Gb DDR4 SDRAM 1Gx16 FBGA-96 | SK Hynix
MPN: H5ANAG6NCR-UHC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.6 | $116.00 |
| 100 | $10.45 | $1,045.00 |
| 500 | $9.8 | $4,900.00 |
| 1,000 | $9.2 | $9,200.00 |
Drop-in alternatives for H5ANAG6NCR-UHC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5ANAG6NCR-UHC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Density | 16 Gb (2 GB) |
| Organization | 1G x 16 |
| Interface | CMOS, Double Data Rate IV |
| Package | FBGA-96 (PBGA-96) |
| Die Revision | C |
| Configuration | 1 Channel, 1 Rank |
| Mounting Type | Surface Mount |
| Application | Main memory, embedded computing, industrial controllers |
H5ANAG6NCR-UHC fbga-96 (pbga-96) Pin Configuration Guide
Complete pinout information for H5ANAG6NCR-UHC (fbga-96 (pbga-96) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG6NCR-UHC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG6NCR-UHC is suitable for 6 applications: Embedded Computing Modules, Industrial Controllers, Network Appliances, Data Logging and Embedded Storage Caching, Test and Measurement Instruments, Replacement Sourcing and BOM Continuity.
Embedded Computing Modules
Embedded x86 and ARM computing modules (COM Express, SMARC, custom SoMs) need dense main memory in minimal board area. The H5ANAG6NCR-UHC provides 2GB per package at 1Gx16 organization in a 0.8 x 1.0-inch-class 96-ball FBGA, so a module can reach 4GB with just two components on a 32-bit bus. The x16 strobe configuration (UDQS/LDQS) simplifies length-matched routing versus eight x8 parts. Because DDR4 uses a fly-by clock topology with on-die termination, the memory controller's ZQ calibration and write-leveling must be run at bring-up; expect to reserve VTT termination rail budget of roughly half the VDDQ current for a 1.2V-class DDR4 interface.
Recommended
Industrial Controllers
Industrial PLCs and motion controllers increasingly run Linux-class firmware that demands gigabytes of working memory for protocol stacks, logging buffers, and HMI rendering. The H5ANAG6NCR-UHC supplies 16Gb density in one FBGA-96 component, reducing BOM line count versus stacking 4Gb parts, and its x16 bus suits the 16/32-bit controllers common in industrial designs. Layout should follow the SK hynix DDR4 design guide: fly-by address/command routing, 40-ohm-class series termination at the controller, and solid VDDQ plane segmentation. Industrial enclosures with limited airflow require derating analysis of the component's operating-temperature specification before qualification.
Recommended
Network Appliances
Packet-processing appliances, security gateways, and router line cards use DDR4 for flow tables, packet buffers, and deep-packet-inspection state. The H5ANAG6NCR-UHC's 1Gx16 organization allows granular memory sizing on 32-bit sub-channels, and 16Gb per package maximizes state capacity per PCB area, directly increasing supported concurrent sessions. Designers should pair the DRAM with a dedicated memory controller or network processor supporting DDR4 burst length 8 and bank-group interleaving, since bank-group scheduling measurably raises effective bandwidth for random-access-heavy packet workloads. Confirm refresh (tRFC) overhead in latency budgets when sizing buffer depth.
Recommended
Data Logging and Embedded Storage Caching
Embedded loggers, gateways, and test instruments use DDR4 as a write cache between high-speed acquisition front ends and slower NAND storage. The H5ANAG6NCR-UHC offers 2GB of buffering in one component; at a 100 MB/s sustained ingest rate this buffer represents roughly 20 seconds of data, enough to absorb NAND erase-cycle stalls without loss. The x16 organization reduces strobe count and simplifies the layout on two-layer-stack instrumentation boards. Designers must implement controller-side wear-aware flushing and power-fail handling, since DDR4 is volatile - pair the DRAM with a supervisor that triggers a safe flush or a backup-energy dump on brownout detection.
Recommended
Test and Measurement Instruments
Oscilloscopes, logic analyzers, and signal generators require deep acquisition memory to capture long time records at high sample rates. The H5ANAG6NCR-UHC, at 16Gb per component, lets an instrument implement multi-gigabyte capture buffers using four packages on a 64-bit bus. DDR4's burst architecture favors the sequential-write pattern of acquisition streaming, and bank-group interleaving sustains near-peak bandwidth for continuous recording. Thermal design matters in benchtop instruments: DDR4 components at sustained streaming loads dissipate measurable power, so placement near fans and copper pour under the FBGA-96 thermal balls improves junction-to-ambient conditions during long captures.
Recommended
Replacement Sourcing and BOM Continuity
Many legacy DDR4-based platforms face obsolescence of older die revisions, forcing replacement sourcing. The H5ANAG6NCR-UHC (C die) is a natural substitute for designs qualified around earlier family members such as the H5ANAG6NAMR (A die) or H5ANAG6NBJR, because all share the same 96-ball FBGA footprint, 1Gx16 organization, and DDR4 protocol interface - no PCB rework is required. The recommended procedure is: confirm the controller timing table against die-revision C data, run a full memory stress test (e.g., extended margin scanning), and update the AVL. This keeps production lines running while capturing the shrink-die benefits of reduced operating current.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG6NCR-UHC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG6NAMR-UHC | H5ANAG6NCR-RDC | H5ANAG6NCR-PBC | H5ANAG6NCJR-XNC | H5ANAG6NBJR-UHC | H5ANAG8NCR-UHC |
|---|---|---|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb (2 GB) | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 2G x 8 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM (DDR4-2400 class family) | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Die Revision | C | A | C | C | J | B | C |
| Speed Grade Suffix | UHC | UHC - same | RDC - different bin | PBC - different bin | XNC - different bin | UHC - same | UHC - same |
| Data Rate | [DATA_NEEDED] | DDR4-2400 (per distributor listing) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Newest C die revision in the 16Gb family (vs H5ANAG6NAMR-UHC)
- Identical UHC speed grade as legacy sibling (vs H5ANAG6NBJR-UHC)
- x16 organization reduces bus complexity (vs H5ANAG8NCR-UHC)
Design Notes
DDR4 requires fly-by routing of address/command/clock with on-die termination and controller-side write leveling. For the x16 H5ANAG6NCR-UHC, keep UDQS/UDQS# and LDQS/LDQS# diff pairs length-matched within +/-5 mils internally and match DQ to its strobe within the controller's specified skew window (typically a few hundred picoseconds). Route at 40-50 ohm single-ended impedance, reference DQ routing to a continuous VDDQ plane, and avoid crossing plane splits under the FBGA-96 fanout. Follow the SK hynix DDR4 design guide for series-termination placement at the controller end.
DDR4 uses separate VDD (core) and VDDQ (interface) rails, nominally 1.2V-class per JEDEC DDR4 convention - confirm exact ranges in the die-revision C datasheet. Estimated: a 16Gb x16 DDR4 operating at DDR4-2400-class rates draws peak currents in the hundreds of milliamps per component; size the VTT termination regulator for roughly half of total VDDQ current and place bulk (100 uF class) plus high-frequency (0.1 uF) decoupling at each rail pin group. VPP, if specified for the family, is a separate 2.5V-class rail - never share it with VDD.
Do not assume datasheet interchange between die revisions. The A-die H5ANAG6NAMR datasheet is the most widely mirrored document, but the C-die H5ANAG6NCR may have updated timing (tRFC, tFAW) and IDD tables; controllers programmed with stale timing sets can show marginal reliability at temperature extremes. Always pull the die-revision-C document from SK hynix before programming controller registers, and re-run write-leveling and read-eye training after any die-revision or speed-suffix change in production.
Compliance Information
Verified web data contains no explicit RoHS/REACH certificate for this exact suffix. Modern SK hynix DDR4 is typically produced as green (lead-free/halogen-free) packaging, but official certificates must be obtained from SK hynix or the distributor. Not an automotive-qualified ordering code.
