H5ANAG6NCJR-XNC vs H5ANAG6NAMR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NCJR-XNC by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG6NCJR-XNC H5ANAG6NCJR-XNC - 16Gb DDR4-3200 SDRAM x16 | SK Hynix

H5ANAG6NCJR-XNC - 16Gb DDR4-3200 SDRAM x16 | SK Hynix

H5ANAG6NCJR-XNC ✓ Active

Specification Comparison

Parameter H5ANAG6NCJR-XNC H5ANAG6NAMR-UHC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $84.97 $4.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 16 Gbit —
Memory Organization 1G x 16 —
Data Rate 3200 Mbps/pin —
Supply Voltage Range 1.14 V to 1.26 V (VDD/VDDQ) —
Interface Parallel —
Package FBGA-96 FBGA-96 (PBGA96)
Mounting Type Surface Mount Surface Mount (BGA solder ball)
Auto Self-Refresh Yes —
Auto Precharge Yes —
Asynchronous Reset Yes —
Data Mask Function Yes —
Dynamic On-Chip Termination (ODT) Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
Packaging Tray —
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Memory Density — 16 Gbit (2 GB)
Organization — 1G x 16
Speed Grade / Data Rate — DDR4-2400 (UHC bin, PC4-19200)
Supply Voltage (VDD) — 1.2 V
Architecture — CMOS DDR4 with bank groups
Power Class — Normal Power
Operating Temperature — [DATA_NEEDED: operating temperature range]
Refresh — Self-refresh and auto-refresh (DDR4 standard 64 ms)
CAS Latency — [DATA_NEEDED: CL for UHC bin]
Interface Type — Parallel, synchronous, double data rate
Available Speed Bins (family) — PB / RD / TF / UH / VK
Application Class — Main memory, embedded, industrial
Lifecycle Status — Active production

Datasheets & Resources

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