H5ANAG6NCMR-XNI vs H5ANAG6NCJR-XN Comparison

Detailed side-by-side comparison of H5ANAG6NCMR-XNI by SK hynix and H5ANAG6NCJR-XN by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG6NCMR-XNI H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI ✓ Active

Specification Comparison

Parameter H5ANAG6NCMR-XNI H5ANAG6NCJR-XN
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.95 $71.20
Memory Type DDR4 SDRAM (volatile DRAM) DDR4 SDRAM
Memory Size 16 Gb —
Memory Organization 1G x 16 —
Data Rate 3200 Mbps (DDR4-3200, XN speed bin) 3200 Mbps/pin (DDR4-3200)
Supply Voltage 1.2 V —
Technology CMOS Double Data Rate IV Synchronous DRAM —
Power Class Normal Power —
Package FBGA-96 FBGA-96 (96-ball)
Mounting Type Surface Mount Surface Mount (BGA)
Interface Parallel (DDR4) —
Product Status Active —
Application Domain Main memory, industrial controllers, computing modules, consumer electronics —
Memory Format DRAM —
Speed Bin Family UH/VK/WM/XN —
Operating Temperature [DATA_NEEDED: Operating Temperature] [DATA_NEEDED: operating temperature range]
VPP Supply Voltage [DATA_NEEDED: VPP Supply Voltage] —
MSL Level [DATA_NEEDED: MSL Level] —
Density — 16 Gbit (1G x 16)
Organization — 1G x 16
Supply Voltage (VDD) — 1.14 V to 1.26 V
Package Width — 8 mm
Auto Self-Refresh — Yes
Auto Precharge — Yes
Asynchronous Reset — Yes
Data Mask (DM) — Yes
Dynamic On-Chip Termination (ODT) — Yes
ZQ Calibration — Yes
CRC (Command/Address) — Yes
Write Leveling — Yes
Maximum Standby Current — 0.074 A (per Vyrian listing)
RoHS Status — Compliant
CAS Latency — [DATA_NEEDED: CAS latency for -XN speed grade]

Datasheets & Resources

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