H5TC4G63AFR-PBA vs K4A8G165WB-BIRC Comparison

Detailed side-by-side comparison of H5TC4G63AFR-PBA by SK hynix and K4A8G165WB-BIRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5TC4G63AFR-PBA H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA ✓ Active
Samsung Electronics
K4A8G165WB-BIRC K4A8G165WB-BIRC - 8Gb DDR4 SDRAM x16 | Samsung | 2400 Mbps

K4A8G165WB-BIRC - 8Gb DDR4 SDRAM x16 | Samsung | 2400 Mbps

K4A8G165WB-BIRC ✓ Active

Specification Comparison

Parameter H5TC4G63AFR-PBA K4A8G165WB-BIRC
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $3.98 $39.50
Memory Type DDR3L SDRAM DDR4 SDRAM
Density 4Gb 8 Gbit
Organization 256M x 16 512M x 16
Supply Voltage (VDD/VDDQ) 1.35V —
Data Rate 1866 Mbps (PC3L-14900) 2400 Mbps
Package 96-ball FBGA 96-ball FBGA
Ball Pitch 0.8mm —
Number of Banks 8 —
Burst Length 8 and 4 (with burst chop) 8, 16
CAS Latency (CL) 11, 12, 13 —
Operating Temperature Range 0°C to +95°C (Tcase) -40°C to +95°C
Interface 16-bit I/O 16-bit
On-Die Termination (ODT) Yes Yes
ZQ Calibration Yes —
Write Leveling Yes —
Auto Self-Refresh Yes —
Partial Array Self-Refresh Yes —
RoHS Compliant —
Supply Voltage — 1.2 V
DLL Enabled Mode — Yes
Row Address — 16 bits
Column Address — 10 bits
Bank Count — 16 banks
RoHS Compliant — Yes

Datasheets & Resources

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