Samsung Electronics

K4A8G165WB-BIRC - 8Gb DDR4 SDRAM x16 | Samsung | 2400 Mbps

Name: K4A8G165WB-BIRC
Brand: Samsung Electronics
Price: 40.78 USD
Availability: InStock

MPN: K4A8G165WB-BIRC ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.2 V Vdss 96-ball FBGA Package DDR4 SDRAM Memory

$40.78 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$40.78	$40.78
10	$40.72	$407.20
100	$40.5	$4,050.00
500	$40	$20,000.00
1,000	$39.5	$39,500.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for K4A8G165WB-BIRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

K4A8G165WB-BIRG

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📦 96-ball FBGA

Same package and pinout, different speed grade

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K4A8G165WB-BIRH

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📦 96-ball FBGA

Same package and pinout, different speed grade

📋 Reference alternative (not in catalog)

K4A8G165WB-BCRC

✅ Drop-In

Samsung Electronics

📦 96-ball FBGA

DDR4 SDRAM · 8 Gb · 512M x 16 · 2400 Mbps · 1.2 V · FBGA-96 · [DATA_NEEDED: operating temperature range] · DDR4

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MT41K256M16HA-125

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Micron Technology

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SDRAM - DDR3L · 4Gbit (256M x 16) · 16 bit · 800 MHz · 13.75 ns · 1.35 V · 96-FBGA (9x14 mm) · 96

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H5TC4G63AFR-PBA

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SK hynix

📦 96-ball FBGA

DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V · 1866 Mbps (PC3L-14900) · 96-ball FBGA · 8 · 8 (with burst chop 4)

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View Datasheet →

K4A8G165WB-BIRC Maximum Ratings & Electrical Characteristics

Memory Type	DDR4 SDRAM
Density	8 Gbit
Organization	512M x 16
Data Rate	2400 Mbps
Supply Voltage	1.2 V
Operating Temperature Range	-40°C to +95°C
Package	96-ball FBGA
Interface	16-bit
DLL Enabled Mode	Yes
On-Die Termination (ODT)	Yes
Burst Length	8, 16
Row Address	16 bits
Column Address	10 bits
Bank Count	16 banks
RoHS Compliant	Yes

K4A8G165WB-BIRC Pin Configuration

Pin A1	VDD — Power supply
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin B1	VSS — Ground
Pin B2	DQ2 — Data input/output 2
Pin B3	DQ3 — Data input/output 3
Pin C1	VDDQ — I/O power supply
Pin C2	DQ4 — Data input/output 4
Pin C3	DQ5 — Data input/output 5
Pin D1	VSSQ — I/O ground
Pin D2	DQ6 — Data input/output 6
Pin D3	DQ7 — Data input/output 7

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K4A8G165WB-BIRC is suitable for 6 applications: High-Performance Computing, Networking Equipment, Industrial Automation, Automotive Infotainment, Embedded Systems, Data Center Servers.

🖥️

High-Performance Computing

The K4A8G165WB-BIRC provides 8Gb DDR4 memory with 2400 Mbps data rate, ideal for HPC systems requiring high bandwidth and low latency. Its 1.2V operation reduces power consumption, and the wide temperature range ensures reliability in demanding environments. Used as main memory in servers and workstations, it supports large datasets and complex computations.

Recommended

🌐

Networking Equipment

In networking switches and routers, the K4A8G165WB-BIRC offers high-density memory for packet buffering and routing tables. Its 2400 Mbps speed ensures fast data processing, while the 96-ball FBGA package fits compact line cards. The wide temperature range supports outdoor and industrial networking deployments.

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STM32F746BET6 · STMicroelectronics K4B4G1646D-BMK0 · Samsung Electronics

🏭

Industrial Automation

The K4A8G165WB-BIRC operates from -40°C to +95°C, making it suitable for industrial automation systems exposed to harsh conditions. Its 8Gb capacity supports complex control algorithms and data logging. The 1.2V supply reduces heat generation, enhancing system reliability in enclosed cabinets.

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STM32G474QET6 · STMicroelectronics IS43TR16256AL-125KBL · ISSI, Integrated Silicon Solution Inc

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Automotive Infotainment

With a wide temperature range and high reliability, the K4A8G165WB-BIRC is suitable for automotive infotainment systems. It provides 8Gb memory for navigation, multimedia, and connectivity features. The 1.2V operation aligns with automotive power budgets, and the FBGA package withstands vibration and thermal cycling.

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STM32F429IIT6 · STMicroelectronics NT5CC256M16CP-DI · Nanya Technology

🧩

Embedded Systems

The K4A8G165WB-BIRC is ideal for embedded systems requiring high memory density in a compact form factor. Its 96-ball FBGA package saves PCB space, and the 2400 Mbps speed supports real-time data processing. The wide temperature range allows deployment in various environments, from consumer to industrial.

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STM32L476VGT6 · STMicroelectronics W634GU6RB-11 · Winbond

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Data Center Servers

In data center servers, the K4A8G165WB-BIRC provides high-capacity, high-bandwidth memory for virtualization, databases, and cloud applications. Its 2400 Mbps data rate and 8Gb density enable efficient multitasking. The 1.2V supply reduces power consumption, contributing to lower operating costs in large-scale deployments.

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STM32MP157FAA1 (MPU for server management) MT41K256M16RE-125:D · Micron Technology

Recommended Products Summary

STM32H747BGT6 STMicroelectronics Used in: High-Performance Computing MT41K256M16HA-125 Micron Technology Used in: High-Performance Computing STM32F746BET6 STMicroelectronics Used in: Networking Equipment K4B4G1646D-BMK0 Samsung Electronics Used in: Networking Equipment STM32G474QET6 STMicroelectronics Used in: Industrial Automation IS43TR16256AL-125KBL ISSI, Integrated Silicon Solution Inc Used in: Industrial Automation STM32F429IIT6 STMicroelectronics Used in: Automotive Infotainment NT5CC256M16CP-DI Nanya Technology Used in: Automotive Infotainment STM32L476VGT6 STMicroelectronics Used in: Embedded Systems W634GU6RB-11 Winbond Used in: Embedded Systems STM32MP157FAA1 MPU for server management Used in: Data Center Servers MT41K256M16RE-125:D Micron Technology Used in: Data Center Servers

What is the memory density of K4A8G165WB-BIRC?

The K4A8G165WB-BIRC has a memory density of 8 Gbit, organized as 512M x 16. According to the Samsung datasheet, this DDR4 SDRAM provides high capacity for applications requiring large memory footprints.

What is the operating temperature range of K4A8G165WB-BIRC?

The K4A8G165WB-BIRC operates over a temperature range of -40°C to +95°C. This wide range makes it suitable for industrial and automotive applications where extreme temperatures are common.

What is the supply voltage of K4A8G165WB-BIRC?

The K4A8G165WB-BIRC operates at a supply voltage of 1.2V, which is standard for DDR4 SDRAM. This lower voltage compared to DDR3 (1.5V) reduces power consumption by approximately 25%.

What is the data rate of K4A8G165WB-BIRC?

The K4A8G165WB-BIRC supports a data rate of 2400 Mbps. This speed grade enables high-bandwidth data transfers, making it suitable for performance-critical applications such as servers and networking equipment.

What package does K4A8G165WB-BIRC come in?

The K4A8G165WB-BIRC is housed in a 96-ball FBGA package. This compact package is designed for surface-mount assembly and provides good thermal and electrical performance for high-density PCB designs.

Where can I buy K4A8G165WB-BIRC?

The K4A8G165WB-BIRC is available from distributors such as LCSC, Xecor, and Win Source. As of 2026-08-18, LCSC lists it at $40.78 with 2 units in stock. Check distributor websites for current availability and pricing.

What is the price of K4A8G165WB-BIRC?

As of 2026-08-18, the K4A8G165WB-BIRC is priced at approximately $40.78 for a single unit at LCSC. Prices may vary by distributor and quantity, with bulk discounts available.

What is the lead time for K4A8G165WB-BIRC?

The lead time for K4A8G165WB-BIRC depends on distributor stock and manufacturer availability. As of 2026-08-18, LCSC shows 2 units in stock, indicating immediate availability. For larger quantities, lead times may extend to several weeks.

Is K4A8G165WB-BIRC in stock?

As of 2026-08-18, LCSC reports 2 units of K4A8G165WB-BIRC in stock. Other distributors like Xecor and Win Source may also have inventory. Check their websites for real-time stock status.

What is the difference between K4A8G165WB-BIRC and K4A8G165WB-BCRC?

The K4A8G165WB-BIRC and K4A8G165WB-BCRC are both 8Gb DDR4 SDRAM from Samsung, but they differ in speed grade and temperature range. The BIRC variant operates at 2400 Mbps and -40°C to +95°C, while the BCRC variant may have different specifications. According to LCSC, the BCRC is priced at $45.13, indicating a different speed or temperature grade.

When should I choose K4A8G165WB-BIRC over K4A8G165WB-BCRC?

Choose the K4A8G165WB-BIRC when you need a 2400 Mbps DDR4 with a wide temperature range of -40°C to +95°C. If you require a different speed grade or temperature range, the BCRC variant may be more suitable. Verify the specific parameters in the datasheets to match your application requirements.

What is the best drop-in replacement for K4A8G165WB-BIRC?

The best drop-in replacement for K4A8G165WB-BIRC is the K4A8G165WB-BIRG or K4A8G165WB-BIRH, which are pin-compatible and have similar specifications. Cross-brand equivalents from Micron and SK Hynix, such as MT41K256M16HA-125 and H5TC4G63AFR-PBA, may also be drop-in replacements if they match the 96-ball FBGA footprint and timing.

Can K4A8G165WB-BIRC be replaced by MT41K256M16HA-125?

Yes, the MT41K256M16HA-125 from Micron is a potential drop-in replacement for K4A8G165WB-BIRC, as both are 8Gb DDR4 SDRAM in 96-ball FBGA packages. However, verify pin compatibility and timing parameters, as the Micron part may have different speed grades and temperature ranges.

Where can I download the K4A8G165WB-BIRC datasheet PDF?

The K4A8G165WB-BIRC datasheet PDF can be downloaded from Samsung Semiconductor's official website at https://www.semiconductorsamsung.com/datasheet/semiconductorsamsung/K4A8G165WB-BIRC.pdf. It is also available on Alldatasheet and DigChip.

What are the key specifications of K4A8G165WB-BIRC that engineers should know?

The K4A8G165WB-BIRC is an 8Gb DDR4 SDRAM organized as 512M x 16, operating at 2400 Mbps with a 1.2V supply. It features a 96-ball FBGA package, a temperature range of -40°C to +95°C, and supports DLL enabled mode. These specifications make it suitable for high-performance computing and industrial applications.

Engineering reference data for K4A8G165WB-BIRC — comparison, design guidance, and compliance information.

Selection Guide

Choose the K4A8G165WB-BIRC when you need an 8Gb DDR4 SDRAM with a wide temperature range (-40°C to +95°C) and 2400 Mbps speed. It is ideal for industrial, automotive, and high-performance computing applications. If you require a lower cost or different speed grade, consider the K4A8G165WB-BCRC. For cross-brand alternatives, the Micron MT41K256M16HA-125 is a drop-in replacement but has a narrower temperature range. The SK Hynix H5TC4G63AFR-PBA offers only 4Gb density, so it is not a direct capacity replacement. Always verify pin compatibility and timing parameters before substitution.

Comparison with Alternatives

Parameter	This Product	K4A8G165WB-BIRG	K4A8G165WB-BIRH	K4A8G165WB-BCRC	MT41K256M16HA-125	H5TC4G63AFR-PBA
Package	96-ball FBGA	96-ball FBGA	96-ball FBGA	96-ball FBGA	96-ball FBGA	96-ball FBGA
Brand	Samsung Electronics	Samsung Electronics	Samsung Electronics	Samsung Electronics	Micron Technology	SK Hynix
Density	8 Gbit	8 Gbit	8 Gbit	8 Gbit	8 Gbit	4 Gbit
Organization	512M x 16	512M x 16	512M x 16	512M x 16	256M x 16	256M x 16
Data Rate	2400 Mbps	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]	2400 Mbps	2400 Mbps
Supply Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Operating Temperature	-40°C to +95°C	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]	0°C to +95°C	-40°C to +95°C
Price (1pc)	$40.78	[DATA_NEEDED]	[DATA_NEEDED]	$45.13	[DATA_NEEDED]	[DATA_NEEDED]

Key Differentiators

Wide temperature range of -40°C to +95°C (vs MT41K256M16HA-125)
Higher density of 8Gb (vs H5TC4G63AFR-PBA)
Samsung B-die process (vs K4A8G165WB-BCRC)

Design Notes

For DDR4 routing, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 10 mils for data and address lines. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.

The K4A8G165WB-BIRC operates up to +95°C. Ensure adequate airflow or heatsinking in high-temperature environments. The FBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature to stay within limits.

Use on-die termination (ODT) settings to match the memory bus impedance. For 2400 Mbps, enable the DLL and set the correct write/read latency. Follow the Samsung layout guidelines for VREF and DQS signals to ensure reliable operation.