H5TC4G63AFR-PBJ vs K4B4G1646D-BCK00 Comparison
Detailed side-by-side comparison of H5TC4G63AFR-PBJ by SK hynix and K4B4G1646D-BCK00 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646D-BCK00 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BCK00 ✓ ActiveSpecification Comparison
| Parameter | H5TC4G63AFR-PBJ | K4B4G1646D-BCK00 |
|---|---|---|
| Brand | SK hynix | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Memory Size | 4 Gb (256M x 16) | — |
| Supply Voltage | 1.35 V | 1.35V (1.283V to 1.45V) |
| Package | 96-ball TFBGA | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| Temperature Grade | Industrial (-40°C to +95°C) | — |
| Refresh Cycles | 8192 | — |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | — |
| Data Rate | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] | 1600 Mbps/pin |
| CAS Latency | [DATA_NEEDED: CAS Latency] | 11 (at 1600 Mbps) |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) | — |
| Auto Self-Refresh | Yes | — |
| Data Mask | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| RoHS Status | [DATA_NEEDED: RoHS Status] | — |
| Density | — | 4 Gb |
| Organization | — | 256M x 16 |
| Speed Grade | — | DDR3-1600 (800 MHz) |
| I/O Voltage | — | 1.35V |
| Operating Temperature | — | 0°C to 95°C (Tcase) |
| Number of Banks | — | 8 |
| Burst Length | — | 8, 4 (with burst chop) |
| RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Halogen Free | — | Yes |