K4A4G165WE-BCTD vs MT40A256M16GE-075E:B Comparison
Detailed side-by-side comparison of K4A4G165WE-BCTD by Samsung Electronics and MT40A256M16GE-075E:B by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A4G165WE-BCTD - 4Gb DDR4 SDRAM 256Mx16 1.2V | Samsung
K4A4G165WE-BCTD ✓ ActiveMicron Technology
MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron
MT40A256M16GE-075E:B ✓ ActiveSpecification Comparison
| Parameter | K4A4G165WE-BCTD | MT40A256M16GE-075E:B |
|---|---|---|
| Brand | Samsung Electronics | Micron Technology |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.38 | $3.95 |
| Memory Type | DDR4 SDRAM (volatile DRAM) | DDR4 SDRAM |
| Memory Size | 4 Gbit | 4 Gbit |
| Memory Organization | 256M x 16 | — |
| Interface | Parallel, x16 | — |
| Supply Voltage (VDD) | 1.2 V (1.14 V to 1.26 V) | — |
| Die Generation | E-die | — |
| Package | FBGA-96 (TFBGA) | 96-FBGA (9 x 14 mm) |
| Terminal Count | 96 | — |
| Operating Temperature | 0C to +85C | [DATA_NEEDED: operating temperature range for standard grade] |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | [DATA_NEEDED: max data rate / CAS latency for -BCTD suffix] | — |
| RoHS Status | Compliant (per JLCPCB listing) | — |
| Product Status | Active | — |
| Datasheet Revision | K4A4G165WE Rev. 1.4, Jun. 2016 | — |
| Burst Length | BL8 (JEDEC DDR4) | — |
| Bank Group Architecture | Yes (DDR4) | — |
| Organization | — | 256M x 16 |
| Memory Interface | — | Parallel |
| Clock Frequency | — | 1.33 GHz |
| Data Rate | — | 2666 MT/s (DDR4-2666) |
| VDD / VDDQ | — | 1.2 V +/-60 mV |
| VPP | — | 2.5 V, -125 mV/+250 mV |
| Internal Banks | — | 16 |
| Refresh | — | 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C |
| I/O Type | — | 1.2 V pseudo open-drain |
| VREFDQ | — | On-die, internal, adjustable generation |
| Special Features | — | Temperature controlled refresh (TCR) |
| Access Time | — | [DATA_NEEDED: CAS latency / access time] |