K4A8G085WB-BCPB vs K4A8G085WC-BCPB Comparison
Detailed side-by-side comparison of K4A8G085WB-BCPB by Samsung Electronics and K4A8G085WC-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WC-BCPB - 8Gb DDR4 SDRAM 2133Mbps 1.2V | Samsung
K4A8G085WC-BCPB ✗ End of LifeSpecification Comparison
| Parameter | K4A8G085WB-BCPB | K4A8G085WC-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | DRAM |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.78 | $2.95 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organization | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2 V (nominal) | 1.2 V |
| Data Rate | 3200 Mbps (PC4-25600) | 2133 Mbps |
| Speed Grade | BC | DDR4-2133 |
| CAS Latency (CL) | 22 | — |
| Burst Length | 8 | — |
| Bank Architecture | 16 banks (4 bank groups) | — |
| Refresh Interval | 7.8 us (up to 85C) | — |
| Interface Type | SSTL-12 | — |
| Termination | ODT / dynamic ODT | — |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | — |
| Package | 78-ball FBGA | 78FBGA |
| Package Dimensions | 11 mm x 11 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Operating Temperature | — | 0 C to +85 C |
| Number of Terminals | — | 78 |
| Maximum Seated Height | — | 1.2 mm |
| Features | — | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Refresh | — | [DATA_NEEDED: refresh rate 1x/2x] |
| CAS Latency | — | [DATA_NEEDED: CAS latency] |
| Die Revision | — | [DATA_NEEDED: die revision] |
| Standard Package Quantity | — | [DATA_NEEDED: standard package quantity] |