K4A8G085WB-BICR vs K4A8G085WB-BICH Comparison
Detailed side-by-side comparison of K4A8G085WB-BICR by Samsung Electronics and K4A8G085WB-BICH by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WB-BICR
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR β ActiveSamsung Electronics
K4A8G085WB-BICH
K4A8G085WB-BICH - 8Gb DDR4 SDRAM 1Gx8 | Samsung
K4A8G085WB-BICH β ActiveSpecification Comparison
| Parameter | K4A8G085WB-BICR | K4A8G085WB-BICH |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.25 | $4.96 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8Gb |
| Organization | 1G x 8 | 1G x 8 |
| Data Rate | 2400 Mbps | 2400 Mbps (DDR4-2400) |
| Supply Voltage | 1.2 V (VDD/VDDQ) | 1.2V |
| Number of Banks | 16 | β |
| Refresh Cycles | 8192 | β |
| Package | 78-ball FBGA | 78-ball FBGA |
| Pin Count | 78 | β |
| Mounting Type | Surface Mount | β |
| Temperature Grade | Industrial (I-grade) | β |
| Operating Temperature Range | [DATA_NEEDED: exact temperature range for BICR industrial suffix] | β |
| Die / Process | Samsung 8Gb B-die DDR4 | β |
| Speed Grade | DDR4-2400 (PC4-19200) | β |
| RoHS Status | Compliant | β |
| Lead-Free | Yes | Yes |
| Refresh Management | Row refresh, auto-refresh and self-refresh supported | β |
| Operating Temperature | β | 0Β°C to 85Β°C |
| Max Supply Current | β | 170mA |
| Burst Length | β | BL8, BL16 |
| CAS Latency | β | Programmable |
| On-Die ECC | β | Yes |
| Data Bus Inversion | β | Yes |
| RoHS | β | Compliant |
| Die Revision | β | B-die |