K4AAG165WA-BCPB vs K4AAG165WA-BCWE Comparison
Detailed side-by-side comparison of K4AAG165WA-BCPB by Samsung Electronics and K4AAG165WA-BCWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ ActiveSpecification Comparison
| Parameter | K4AAG165WA-BCPB | K4AAG165WA-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $63.79 | $62.40 |
| Memory Type | Volatile DRAM (DDR4 SDRAM) | DDR4 SDRAM |
| Technology | DDR4 | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Density | 16 Gb | — |
| Organization | 1G x 16 | — |
| Data Rate | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| Interface Voltage (VDDQ) | 1.2 V | — |
| Package | FBGA-96 | 96-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature for BCPB grade] | -40C to +95C |
| Memory Format | DRAM | DRAM (Volatile) |
| Packaging | Tray | Tray |
| Product Status | Active | Active |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) | — |
| Bank Group Architecture | Yes (DDR4 internal bank groups) | — |
| On-Die Termination (ODT) | Yes | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) | — |
| Memory Size | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Interface Type | — | Parallel, DDR4 |