K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
MPN: K4AAG165WA-BCPB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $79.74 | $79.74 |
| 10 | $75.75 | $757.50 |
| 100 | $71.76 | $7,176.00 |
| 500 | $67.78 | $33,890.00 |
| 1,000 | $63.79 | $63,790.00 |
Drop-in alternatives for K4AAG165WA-BCPB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4AAG165WA-BCWE
✅ Drop-In✓ In Stock
$62.4 / Unit
View Datasheet →K4AAG165WA-BCTD
✅ Drop-In✓ In Stock
$60.59 / Unit
View Datasheet →K4AAG165WA-BIWE
✅ Drop-In📋 Reference alternative (not in catalog)
K4A8G165WC-BCPB
✅ Drop-In✓ In Stock
$1.31 / Unit
View Datasheet →K4A8G165WB-BCPB
✅ Drop-In✓ In Stock
$2.3 / Unit
View Datasheet →K4AAG165WA-BCPB Maximum Ratings & Electrical Characteristics
| Memory Type | Volatile DRAM (DDR4 SDRAM) |
| Technology | DDR4 |
| Density | 16 Gb |
| Organization | 1G x 16 |
| Data Rate | 3200 Mbps |
| Supply Voltage (VDD) | 1.2 V |
| Interface Voltage (VDDQ) | 1.2 V |
| Package | FBGA-96 |
| Mounting Type | Surface Mount |
| Memory Format | DRAM |
| Packaging | Tray |
| Product Status | Active |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | Yes |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) |
K4AAG165WA-BCPB fbga-96 Pin Configuration Guide
Complete pinout information for K4AAG165WA-BCPB (fbga-96 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4AAG165WA-BCPB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4AAG165WA-BCPB is suitable for 6 applications: Notebook and Laptop Memory, Embedded and Industrial Computing, Networking Equipment, Consumer Electronics and Set-Top Platforms, Test and Measurement Instruments, Automotive Infotainment and Displays (Non-Safety).
Notebook and Laptop Memory
The K4AAG165WA-BCPB fits discrete notebook memory designs where 16 Gb per chip maximizes capacity within a limited component count. A 64-bit DDR4 bus needs only four of these x16 devices to reach 8 GByte, versus eight 8 Gb parts, halving BOM position count and PCB area under the SoC. Operating at 3200 Mbps class speed with 1.2 V rails, it aligns with mainstream mobile platforms and benefits from DDR4's roughly 25% lower power versus DDR3, improving battery runtime and thermal headroom in thin chassis. Designers should follow Samsung's product guide for length-matched routing and ODT programming to hold signal integrity at full data rate.
Recommended
Embedded and Industrial Computing
Industrial gateways, HMI panels, and embedded controllers use the K4AAG165WA-BCPB where 2 GByte per chip simplifies memory sizing for Linux-class workloads. The FBGA-96 footprint mounts on four or six-layer boards with standard DDR4 fly-by topology, and the 1.2 V VDD/VDDQ rails integrate easily with common PMICs designed for DDR4 platforms. For industrial ambient conditions, pair with the same-die industrial-grade variant K4AAG165WA-BIWE, which is listed specifically for industrial substitution in icDirectory cross-reference data. Verify the controller's address map supports 1G x 16 row/column geometry before finalizing the boot configuration.
Recommended
Networking Equipment
Enterprise switch and router control planes require large, fast buffers for packet tables and flow state; the K4AAG165WA-BCPB provides 16 Gb at 3200 Mbps class bandwidth on a compact x16 interface. Its bank-group architecture improves effective bandwidth for the random access patterns typical of packet processing, and 1.2 V operation keeps switch-line-card power budgets in check. Because networking boards often run 24/7 at elevated ambient, thermal design and conservative derating of the 1.2 V rails are recommended, and the same-family speed/temperature suffix variants allow one PCB layout to serve multiple performance tiers.
Recommended
Consumer Electronics and Set-Top Platforms
Smart TV, set-top box, and gaming-peripheral SoCs frequently require 1.5-4 GByte of DDR4; two K4AAG165WA-BCPB chips deliver 4 GByte on a 32-bit bus with minimal PCB area. The 3200 Mbps class rate supports 4K video decode headroom, while DDR4's lower 1.2 V power simplifies passive cooling in enclosed set-top housings. Cost per GByte at the 16 Gb density point is favorable versus stacking smaller parts. Repair and refurbishment channels also use this exact FBGA-96 component for standalone chip replacement on Samsung-equipped laptops, as documented in aftermarket repair guides for the -BCWE variant.
Recommended
Test and Measurement Instruments
Oscilloscope, logic analyzer, and signal-generator designs capture long records, and main acquisition memory is a dominant cost. The K4AAG165WA-BCPB's 16 Gb density lets an instrument board store multi-gigabyte waveforms with a small number of x16 devices, and its 3200 Mbps class interface keeps data streaming to acquisition ASICs within budget. Deterministic latency is less critical here than capacity, so designers often clock below maximum data rate for timing margin, using the same-family speed-grade suffix variants. Follow Samsung's guidelines for ZQ calibration and write leveling during controller bring-up to guarantee margin across production units.
Recommended
Automotive Infotainment and Displays (Non-Safety)
Automotive infotainment SoCs and cluster display controllers commonly specify industrial-temperature DDR4; the K4AAG165WA-BCPB family supports this use via its industrial-grade suffix variant K4AAG165WA-BIWE. Sixteen gigabit per chip meets the 2-4 GByte typical demand of navigation and 3D cluster rendering, and the x16 organization matches the 32/64-bit memory controllers common in these SoCs. Note this component itself is not AEC-Q100 characterized; for safety-critical or powertrain domains, select purpose-built automotive DDR4 instead. The 1.2 V rails ease integration with automotive PMIC DDR4 outputs and support the extended-temperature power budget of dash-mounted electronics.
Recommended
Recommended Products Summary
Engineering reference data for K4AAG165WA-BCPB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4AAG165WA-BCWE | K4AAG165WA-BCTD | K4AAG165WA-BIWE | K4A8G165WC-BCPB | K4A8G165WB-BCPB |
|---|---|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same footprint | FBGA-96 - same footprint |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 8 Gb | 8 Gb |
| Organization | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 512M x 16 | 512M x 16 |
| Technology | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | [DATA_NEEDED: BCPB suffix temperature decode] | -40C to +95C (per LCSC) | [DATA_NEEDED] | Industrial grade (per icDirectory) | 0C to 85C (per DigChip family data) | [DATA_NEEDED] |
| Product Status | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Highest density per socket in the x16 family on this page (vs K4A8G165WC-BCPB)
- Same-die temperature-grade freedom within one footprint (vs K4AAG165WA-BCWE)
- x16 interface simplicity versus x8 (vs K4AAG085WA-BCWE)
Design Notes
Route the DDR4 bus using fly-by topology for command/address/clock with series termination at the far end, and length-match data groups (DQ/DM/DQS) within the tight per-group skew budget specified in the Samsung DDR4 product guide. Keep the FBGA-96 footprint with via-in-pad or dog-bone escape as appropriate for 3200 Mbps-class operation. Reference all signals to solid VSS/VDDQ planes; do not split reference planes under data groups.
Provide tightly regulated 1.2 V for VDD and VDDQ per DDR4 requirements, plus VPP and VTT rails per the datasheet power table. Use bulk capacitance near each rank and distribute 0.1 uF ceramics at each power ball. Estimated: four devices on a 64-bit bus at typical DDR4 activity can draw on the order of 1-2 A per rail depending on access pattern - size the PMIC accordingly, then validate against Samsung's IDD specification tables for your operating frequency.
Decode the full ordering code before purchase: the suffix letters encode die revision handling, speed bin, and temperature grade, so an -BCPB is not automatically interchangeable with -BCWE or -BCTD in extended-temperature designs. Also confirm the SoC memory controller supports 1G x 16 geometry and DDR4 bank groups; mismatched row/column/address maps cause boot failures that mimic solder defects.
At 3200 Mbps class rates, enable controller write leveling, read training, and ZQ calibration during bring-up, and program on-die termination (ODT) values per the Samsung DDR4 product guide recommendations for your topology (two vs four devices per channel). Eye-margin validation across temperature corners is recommended before releasing the layout to production.
Compliance Information
Compliance data was not present in the provided verified web data. Samsung DRAM components are typically RoHS compliant, but this must be confirmed on the official Samsung product page before use.
