K4B4G1646D-BYH90 vs K4B4G1646E-BYK000 Comparison
Detailed side-by-side comparison of K4B4G1646D-BYH90 by Samsung Electronics and K4B4G1646E-BYK000 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646D-BYH90
K4B4G1646D-BYH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BYH90 β ActiveSamsung Electronics
K4B4G1646E-BYK000
K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
K4B4G1646E-BYK000 β ActiveSpecification Comparison
| Parameter | K4B4G1646D-BYH90 | K4B4G1646E-BYK000 |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.80 | $0.56 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | β |
| Organization | 512M x 16 | 256M x 16 |
| Data Rate | 2133 Mbps/pin | β |
| Supply Voltage | 1.35V (1.283V to 1.45V) | β |
| I/O Interface | x16 | β |
| Number of Banks | 8 | [DATA_NEEDED: bank count] |
| Package | 96-ball FBGA (TFBGA) | 96-FBGA (BYK) |
| Ball Pitch | 0.8 mm | β |
| Operating Temperature | 0Β°C to +85Β°C | [DATA_NEEDED: operating temperature range] |
| CAS Latency | Programmable (e.g., 11, 12, 13) | β |
| Burst Length | 8 and 4 (with burst chop) | β |
| On-Die Termination | Yes (ODT pin) | β |
| ZQ Calibration | Yes (240-ohm resistor to ground) | β |
| RoHS | Compliant | β |
| Lead-Free | Yes | β |
| Halogen-Free | Yes | β |
| Memory Size | β | 4 Gbit |
| Speed Grade | β | DDR3-1600 (1.25 ns clock cycle) |
| Clock Frequency | β | 800 MHz |
| CAS Latency (CL) | β | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] |
| Supply Voltage (VDD) | β | 1.35 V (DDR3L), 1.5 V compatible (DDR3) |
| Die Process | β | Samsung E-die |
| Mounting Type | β | Surface Mount |
| Interface | β | Parallel |
| Features | β | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask |
| RoHS Status | β | [DATA_NEEDED: RoHS status] |
| Access Time | β | 1.25 ns |