K4B4G1646D-BYH90 vs K4B4G1646E-BYK000 Comparison

Detailed side-by-side comparison of K4B4G1646D-BYH90 by Samsung Electronics and K4B4G1646E-BYK000 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646D-BYH90 K4B4G1646D-BYH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BYH90 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BYH90 ✓ Active
Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ Active

Specification Comparison

Parameter K4B4G1646D-BYH90 K4B4G1646E-BYK000
Brand Samsung Electronics Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gb —
Organization 512M x 16 256M x 16
Data Rate 2133 Mbps/pin —
Supply Voltage 1.35V (1.283V to 1.45V) —
I/O Interface x16 —
Number of Banks 8 [DATA_NEEDED: bank count]
Package 96-ball FBGA (TFBGA) 96-FBGA (BYK)
Ball Pitch 0.8 mm —
Operating Temperature 0°C to +85°C [DATA_NEEDED: operating temperature range]
CAS Latency Programmable (e.g., 11, 12, 13) —
Burst Length 8 and 4 (with burst chop) —
On-Die Termination Yes (ODT pin) —
ZQ Calibration Yes (240-ohm resistor to ground) —
RoHS Compliant —
Lead-Free Yes —
Halogen Free Yes —
Memory Size — 4 Gbit
Speed Grade — DDR3-1600 (1.25 ns clock cycle)
Clock Frequency — 800 MHz
CAS Latency (CL) — [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data]
Supply Voltage (VDD) — 1.35 V (DDR3L), 1.5 V compatible (DDR3)
Die Process — Samsung E-die
Mounting Type — Surface Mount
Interface — Parallel
Features — Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask
RoHS Status — [DATA_NEEDED: RoHS status]
Access Time — 1.25 ns

Datasheets & Resources

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