K4B4G1646E-BYMA vs H5TC4G63AFR-PBI Comparison
Detailed side-by-side comparison of K4B4G1646E-BYMA by Samsung Electronics and H5TC4G63AFR-PBI by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4B4G1646E-BYMA | H5TC4G63AFR-PBI |
|---|---|---|
| Brand | Samsung Electronics | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.32 | $6.50 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | — |
| Organization | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V (1.28 V to 1.575 V) | 1.35 V |
| Clock Frequency | 933 MHz | — |
| Data Rate | 1866 Mbps/pin | DDR3-1600 (PC3L-12800) |
| Operating Temperature | 0°C to +95°C | — |
| Operating Current | 14 mA | — |
| Standby Current | 2 mA, 3 mA | — |
| Package | FBGA-96 | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS | Compliant | — |
| CAS Latency | [DATA_NEEDED: CAS Latency] | Programmable |
| Burst Length | [DATA_NEEDED: Burst Length] | 8 (BL8) |
| Number of Pins | 96 | — |
| Total Memory Size | — | 4 Gb |
| Number of Banks | — | 8 |
| On-Die Termination (ODT) | — | Yes |
| Refresh Period | — | 7.8 us at 85°C |
| Operating Temperature Range | — | -40°C to +95°C |
| Number of Terminals | — | 96 |
| RoHS Status | — | Compliant |