K4B4G1646E-BYMATCV vs IS43TR16256AL-125KBL Comparison

Detailed side-by-side comparison of K4B4G1646E-BYMATCV by Samsung Electronics and IS43TR16256AL-125KBL by ISSI, Integrated Silicon Solution Inc. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646E-BYMATCV K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung

K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung

K4B4G1646E-BYMATCV ✓ Active
ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBL IS43TR16256AL-125KBL - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-125KBL - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-125KBL ✓ Active

Specification Comparison

Parameter K4B4G1646E-BYMATCV IS43TR16256AL-125KBL
Brand Samsung Electronics ISSI, Integrated Silicon Solution Inc
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR3L SDRAM SDRAM - DDR3L
Memory Size 4 Gbit (256M x 16) 4Gbit (256M x 16)
Data Rate 1866 Mbps 1600 Mbps
Supply Voltage 1.35 V 1.35V (backward compatible to 1.5V)
I/O Voltage (VDDQ) 1.35 V —
Package 96-ball FBGA 96-TWBGA (9x13mm)
Number of Pins 96 —
Operating Temperature Range -40°C to +95°C —
Number of Banks 8 —
Burst Length 8 (with burst chop 4) —
CAS Latency Programmable (e.g., 13, 12, 11) —
On-Die Termination (ODT) Yes —
Auto Precharge Yes —
Self-Refresh Yes —
RoHS Status Compliant Compliant
Interface — Parallel
Clock Frequency — 800 MHz
Access Time — 20 ns
Mounting Type — Surface Mount
Operating Temperature — 0°C ~ 95°C
Memory Format — DRAM
Technology — SDRAM - DDR3L
Lead-Free — Yes
Number of Terminals — 96

Datasheets & Resources

Browse All Products Create BOM Request Quote