K4RBH165VB-BCQK vs K4RHE165VB-BCWM Comparison
Detailed side-by-side comparison of K4RBH165VB-BCQK by Samsung Electronics and K4RHE165VB-BCWM by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4RHE165VB-BCWM - 24Gb DDR5 SDRAM 5600Mbps 1.1V | Samsung
K4RHE165VB-BCWM ✓ ActiveSpecification Comparison
| Parameter | K4RBH165VB-BCQK | K4RHE165VB-BCWM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Memory Size | 16 Gb | — |
| Organization | 1G x 16 | 1G x 16 |
| Data Rate | 4800 Mbps/pin | 5600 Mbps |
| Speed Grade | BCQK (4800 Mbps) | — |
| Operating Temperature | 0 C to +85 C | 0 to 85 C |
| Self Refresh | Auto self-refresh | — |
| Reset Function | Asynchronous reset | — |
| Error Correction | On-chip (on-die) ECC | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Supply Voltage | [DATA_NEEDED: core supply voltage (VDD), nominally 1.1 V for DDR5] | 1.1 V |
| Package Type | [DATA_NEEDED: exact package code, expected FBGA surface mount] | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Burst Length | [DATA_NEEDED: burst length (BL16 per DDR5 standard)] | — |
| Density | — | 24 Gb (3 GB) |
| Package | — | 106 FBGA |
| Product Status | — | Mass Production |
| Interface | — | DDR5 (parallel, DDR) |
| Access Type | — | Synchronous |
| Clock Rate (nominal) | — | 2800 MHz (5600 MT/s DDR) |
| Ball Count | — | 106 |
| MSL Level | — | [DATA_NEEDED: MSL Level] |
| Standard Pack Quantity | — | [DATA_NEEDED: Standard Pack Quantity] |