K4RCH046VM-2CCM vs K4RHE086VB-BCWM Comparison
Detailed side-by-side comparison of K4RCH046VM-2CCM by Samsung Electronics and K4RHE086VB-BCWM by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RCH046VM-2CCM | K4RHE086VB-BCWM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $7.65 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 32 Gb | 24 Gb |
| Organization | 4G x 4 | 2G x 8 |
| Data Rate | 5600 Mbps | 5600 Mbps |
| Supply Voltage | 1.1 V | 1.1 V |
| Operating Temperature | 0 to 85 C | [DATA_NEEDED: operating temperature range] |
| Package | 78-ball FBGA | 82 FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Sample | — |
| Access Latency (CL) | [DATA_NEEDED: CAS latency] | — |
| Refresh Rate | [DATA_NEEDED: refresh rate] | — |
| Interface Type | [DATA_NEEDED: interface type] | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | unknown |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | [DATA_NEEDED: on-die ECC support] |
| Interface | — | DDR5 (JEDEC) |
| Configuration | — | x8 |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| Package Height | — | [DATA_NEEDED: package height] |