K4RCH046VM-2CLP vs K4RHE086VB-BCWM Comparison
Detailed side-by-side comparison of K4RCH046VM-2CLP by Samsung Electronics and K4RHE086VB-BCWM by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RCH046VM-2CLP | K4RHE086VB-BCWM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10.10 | $7.65 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 32 Gb | 24 Gb |
| Organization | 4G x 4 | 2G x 8 |
| Data Rate | 6400 Mbps | 5600 Mbps |
| Supply Voltage | 1.1 V | 1.1 V |
| Operating Temperature | 0C to 85C | [DATA_NEEDED: operating temperature range] |
| Package | 78-FBGA | 82 FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration | x4 component | x8 |
| Interface | DDR5 (SSTL-style low-voltage signaling) | DDR5 (JEDEC) |
| Family Speed Range (Samsung DDR5) | up to 7200 Mbps | — |
| Family Density Range (Samsung DDR5) | 16 Gb to 32 Gb | — |
| Power Efficiency vs DDR4 | Approx. 30% greater | — |
| Product Status (per distributor listing) | Sample / Active supply via distribution | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | unknown |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |
| Package Height | — | [DATA_NEEDED: package height] |