K4RHE086VB-BCWM vs K4RHE086VP Comparison
Detailed side-by-side comparison of K4RHE086VB-BCWM by Samsung Electronics and K4RHE086VP by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RHE086VB-BCWM | K4RHE086VP |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | DDR5 |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.65 | $9.90 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 24 Gb |
| Organization | 2G x 8 | x8 |
| Data Rate | 5600 Mbps | — |
| Supply Voltage | 1.1 V | — |
| Package | 82 FBGA | — |
| Mounting Type | Surface Mount | Surface Mount |
| Interface | DDR5 (JEDEC) | — |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | — |
| Manufacturer | Samsung Semiconductor | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | Yes (DDR5 standard feature) |
| Package Height | [DATA_NEEDED: package height] | — |
| Process Node | — | 1a-class (D1a) |
| Package Type | — | FBGA |
| Interface Type | — | DDR5 (double data rate 5) |
| Maximum Data Rate | — | [DATA_NEEDED: speed bin data rate] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: VDD in V] |
| Bank Groups | — | [DATA_NEEDED: bank group count] |
| Operating Temperature Range | — | [DATA_NEEDED: temperature range] |
| Brand | — | Samsung Electronics |
| Product Family | — | Samsung K4RHE DDR5 series |
| Typical Application | — | Server / client DRAM modules |