M29F160FB55N3F2 vs M29F800FB55N3F2 Comparison

Detailed side-by-side comparison of M29F160FB55N3F2 by Micron Technology and M29F800FB55N3F2 by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
M29F160FB55N3F2 M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 Obsolete
Micron Technology
M29F800FB55N3F2 M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 ✓ Active

Specification Comparison

Parameter M29F160FB55N3F2 M29F800FB55N3F2
Brand Micron Technology Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $5.60 $2.47
Memory Type Parallel NOR Flash —
Density 16777 kbits (16 Mbit) —
Organization 1 Mword x 16 bits / 2 Mbyte x 8 bits 1M x 8 / 512K x 16
Number of Words 1000 k —
Bits per Word 16 bits —
Access Time 55 ns 55 ns
Supply Voltage 5 V 5 V
Boot Block Architecture Bottom Boot Block Bottom Boot Block
Operating Temperature -40 to +125 C -40C to +125C
Interface Parallel —
Package Type 48-TSOP 48-pin TSOP1
Mounting Type Surface Mount Surface Mount
Termination Finish Lead-free (F2 suffix) —
Program/Erase Controller Embedded byte/word program algorithms Embedded byte/word program algorithms
Block Protection Hardware boot block protection —
RoHS Status Compliant (lead-free) Compliant (lead-free terminations)
Speed Grade (from MPN) 55 (55 ns) —
Memory Density — 8389 kbits (8 Mbit)
Interface Type — Parallel NOR
Temperature Grade — Automotive (AEC-Q100)
Package Shape — Rectangular (JESD designation TSOP1)
Terminal Count — 48
JESD-609 Termination Code — e3 (lead-free)
Packaging — Tape & Reel (T/R)

Datasheets & Resources

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