M29F160FB55N3F2 vs M29F800FB55N3F2 对比
详细并排对比 M29F160FB55N3F2 出自 Micron Technology 和 M29F800FB55N3F2 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | M29F160FB55N3F2 | M29F800FB55N3F2 |
|---|---|---|
| 品牌 | Micron Technology | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.60 | $2.47 |
| 存储器类型 | Parallel NOR Flash | — |
| Density | 16777 kbits (16 Mbit) | — |
| 存储组织 | 1 Mword x 16 bits / 2 Mbyte x 8 bits | 1M x 8 / 512K x 16 |
| Number of Words | 1000 k | — |
| Bits per Word | 16 bits | — |
| Access Time | 55 ns | 55 ns |
| 电源电压 | 5 V | 5 V |
| Boot Block Architecture | Bottom Boot Block | Bottom Boot Block |
| 工作温度 | -40 to +125 C | -40C to +125C |
| 接口 | Parallel | — |
| Package Type | 48-TSOP | 48-pin TSOP1 |
| 安装类型 | Surface Mount | Surface Mount |
| Termination Finish | Lead-free (F2 suffix) | — |
| Program/Erase Controller | Embedded byte/word program algorithms | Embedded byte/word program algorithms |
| Block Protection | Hardware boot block protection | — |
| RoHS 状态 | Compliant (lead-free) | Compliant (lead-free terminations) |
| Speed Grade (from MPN) | 55 (55 ns) | — |
| Memory Density | — | 8389 kbits (8 Mbit) |
| 接口类型 | — | Parallel NOR |
| Temperature Grade | — | Automotive (AEC-Q100) |
| Package Shape | — | Rectangular (JESD designation TSOP1) |
| Terminal Count | — | 48 |
| JESD-609 Termination Code | — | e3 (lead-free) |
| Packaging | — | Tape & Reel (T/R) |