MC9S08AC32CFGE vs MC9S08AC16MFDE Comparison

Detailed side-by-side comparison of MC9S08AC32CFGE by NXP Semiconductors and MC9S08AC16MFDE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08AC32CFGE MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE ✓ Active
NXP Semiconductors
MC9S08AC16MFDE MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE ✓ Active

Specification Comparison

Parameter MC9S08AC32CFGE MC9S08AC16MFDE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $2.65
Core Processor S08 (HCS08) —
Core Size 8-Bit —
Maximum Clock Frequency 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory Size 32 KB (32K x 8) —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
Number of I/O 38 —
Package 44-LQFP (10x10 mm) QFN-48 (7x7 mm) with Exposed Pad
Mounting Type Surface Mount Surface Mount
Product Series S08AC (Flexis series) —
Program Memory Type Flash Flash
Life Cycle Stage ACTIVE —
RAM Size [DATA_NEEDED: RAM size] 1 KB
ADC Resolution [DATA_NEEDED: ADC resolution] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] -40 C to +125 C
RoHS Status RoHS Compliant Compliant
Debug Interface Background Debug Mode (BDM), 6-pin connector Background Debug Mode (BDM)
Core Architecture — HCS08 (8-bit) CISC
Program Memory Size — 16 KB (16K x 8)
CPU Clock Speed — 40 MHz
Number of I/O Pins — 38
Peripherals — TPM, ADC, SCI, SPI, I2C
Lead-Free — Yes
Lifecycle Status — Active

Datasheets & Resources

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