MC9S08AC32CFGE vs MC9S08AC16MFDE Comparación
Comparación detallada lado a lado de MC9S08AC32CFGE por NXP Semiconductors y MC9S08AC16MFDE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP
MC9S08AC32CFGE ✓ Activo
Comparación de especificaciones
| Parámetro | MC9S08AC32CFGE | MC9S08AC16MFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $2,65 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Frecuencia de reloj máxima | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory Size | 32 KB (32K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 38 | — |
| Encapsulado | 44-LQFP (10x10 mm) | QFN-48 (7x7 mm) with Exposed Pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Product Series | S08AC (Flexis series) | — |
| Program Memory Type | Flash | Flash |
| Life Cycle Stage | ACTIVE | — |
| RAM Size | [DATA_NEEDED: RAM size] | 1 KB |
| ADC Resolution | [DATA_NEEDED: ADC resolution] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Estado RoHS | RoHS Compliant | Compliant |
| Debug Interface | Background Debug Mode (BDM), 6-pin connector | Background Debug Mode (BDM) |
| Core Architecture | — | HCS08 (8-bit) CISC |
| Program Memory Size | — | 16 KB (16K x 8) |
| CPU Clock Speed | — | 40 MHz |
| Number of I/O Pins | — | 38 |
| Peripherals | — | TPM, ADC, SCI, SPI, I2C |
| Lead-Free | — | Yes |
| Estado del ciclo de vida | — | Active |