MC9S08AC32CFGE vs MC9S08AC16MFDE 对比

详细并排对比 MC9S08AC32CFGE 出自 NXP Semiconductors 和 MC9S08AC16MFDE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08AC32CFGE MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE ✓ 量产中
NXP Semiconductors
MC9S08AC16MFDE MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE ✓ 量产中

规格对比

参数 MC9S08AC32CFGE MC9S08AC16MFDE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $2.65
Core Processor S08 (HCS08) —
Core Size 8-Bit —
最大时钟频率 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory Size 32 KB (32K x 8) —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
Number of I/O 38 —
封装 44-LQFP (10x10 mm) QFN-48 (7x7 mm) with Exposed Pad
安装类型 Surface Mount Surface Mount
Product Series S08AC (Flexis series) —
Program Memory Type Flash Flash
Life Cycle Stage ACTIVE —
RAM Size [DATA_NEEDED: RAM size] 1 KB
ADC Resolution [DATA_NEEDED: ADC resolution] —
工作温度范围 [DATA_NEEDED: operating temperature range] -40 C to +125 C
RoHS 状态 RoHS Compliant Compliant
Debug Interface Background Debug Mode (BDM), 6-pin connector Background Debug Mode (BDM)
Core Architecture — HCS08 (8-bit) CISC
Program Memory Size — 16 KB (16K x 8)
CPU Clock Speed — 40 MHz
Number of I/O Pins — 38
Peripherals — TPM, ADC, SCI, SPI, I2C
Lead-Free — Yes
生命周期状态 — Active

数据手册与资源

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