MC9S08AC32CFGE vs MC9S08AC16MFDE Vergleich
Detaillierter Direktvergleich von MC9S08AC32CFGE von NXP Semiconductors und MC9S08AC16MFDE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP
MC9S08AC32CFGE ✓ Aktiv
Spezifikationsvergleich
| Parameter | MC9S08AC32CFGE | MC9S08AC16MFDE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $2,65 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Maximale Taktfrequenz | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory Size | 32 KB (32K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 38 | — |
| Gehäuse | 44-LQFP (10x10 mm) | QFN-48 (7x7 mm) with Exposed Pad |
| Montageart | Surface Mount | Surface Mount |
| Product Series | S08AC (Flexis series) | — |
| Program Memory Type | Flash | Flash |
| Life Cycle Stage | ACTIVE | — |
| RAM Size | [DATA_NEEDED: RAM size] | 1 KB |
| ADC Resolution | [DATA_NEEDED: ADC resolution] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| RoHS-Status | RoHS Compliant | Compliant |
| Debug Interface | Background Debug Mode (BDM), 6-pin connector | Background Debug Mode (BDM) |
| Core Architecture | — | HCS08 (8-bit) CISC |
| Program Memory Size | — | 16 KB (16K x 8) |
| CPU Clock Speed | — | 40 MHz |
| Number of I/O Pins | — | 38 |
| Peripherals | — | TPM, ADC, SCI, SPI, I2C |
| Lead-Free | — | Yes |
| Lebenszyklusstatus | — | Active |