MC9S08DN32AMLC vs MC9S08DN32CLC Comparison
Detailed side-by-side comparison of MC9S08DN32AMLC by NXP Semiconductors and MC9S08DN32CLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08DN32AMLC | MC9S08DN32CLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.98 | $4.25 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 25 |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | — |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Operating Temperature | -40 C to +125 C | — |
| Supply Voltage | [DATA_NEEDED: VDD range] | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS Status | Compliant | — |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |