MC9S08DN32AMLC vs MC9S08DN32CLC Comparación
Comparación detallada lado a lado de MC9S08DN32AMLC por NXP Semiconductors y MC9S08DN32CLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN32AMLC | MC9S08DN32CLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,98 | $4,25 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 25 |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | — |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Encapsulado | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Temperatura de funcionamiento | -40 C to +125 C | — |
| Tensión de alimentación | [DATA_NEEDED: VDD range] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Estado RoHS | Compliant | — |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |