MC9S08DN32AMLC vs MC9S08DN32CLC 对比

详细并排对比 MC9S08DN32AMLC 出自 NXP Semiconductors 和 MC9S08DN32CLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DN32CLC MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32

MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32

MC9S08DN32CLC Obsolete

规格对比

参数 MC9S08DN32AMLC MC9S08DN32CLC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $3.98 $4.25
Core HCS08 (S08) —
Instruction Set HC08 with BGND —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) —
EEPROM Embedded —
Number of I/O 25 25
ADC 12-bit, up to 16 channels, 2.5 us conversion —
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
封装 32-LQFP (7x7 mm) 32-LQFP (7x7 mm)
工作温度 -40 C to +125 C —
电源电压 [DATA_NEEDED: VDD range] —
安装类型 Surface Mount Surface Mount
Packaging Tray —
RoHS 状态 Compliant —
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
CPU Speed — 40 MHz
Program Memory Size — 32 KB (32K x 8) FLASH
RAM Size — 1 KB
EEPROM Size — 1 KB (1K x 8)
Connectivity — I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Terminal Form — GULL WING
No. of Terminals — 32
Package Shape — SQUARE
Temperature Grade — INDUSTRIAL
Part Status — Obsolete

数据手册与资源

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