MC9S08DN32AMLC vs MC9S08DN32CLC Vergleich
Detaillierter Direktvergleich von MC9S08DN32AMLC von NXP Semiconductors und MC9S08DN32CLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN32AMLC | MC9S08DN32CLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,98 | $4,25 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 25 |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | — |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Gehäuse | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Betriebstemperatur | -40 C to +125 C | — |
| Versorgungsspannung | [DATA_NEEDED: VDD range] | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS-Status | Compliant | — |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |