MC9S08DN32AMLC vs MC9S08DN32CLC 비교

다음의 상세 나란히 비교: MC9S08DN32AMLC 제조: NXP Semiconductors 및 MC9S08DN32CLC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DN32CLC MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32

MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32

MC9S08DN32CLC Obsolete

사양 비교

파라미터 MC9S08DN32AMLC MC9S08DN32CLC
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND Obsolete
재고 상태 In Stock In Stock
단가 (USD) $3.98 $4.25
Core HCS08 (S08) —
Instruction Set HC08 with BGND —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) —
EEPROM Embedded —
Number of I/O 25 25
ADC 12-bit, up to 16 channels, 2.5 us conversion —
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
패키지 32-LQFP (7x7 mm) 32-LQFP (7x7 mm)
동작 온도 -40 C to +125 C —
공급 전압 [DATA_NEEDED: VDD range] —
실장 유형 Surface Mount Surface Mount
Packaging Tray —
RoHS 상태 Compliant —
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
CPU Speed — 40 MHz
Program Memory Size — 32 KB (32K x 8) FLASH
RAM Size — 1 KB
EEPROM Size — 1 KB (1K x 8)
Connectivity — I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Terminal Form — GULL WING
No. of Terminals — 32
Package Shape — SQUARE
Temperature Grade — INDUSTRIAL
Part Status — Obsolete

데이터시트 & 자료

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