MCF5271CAB100 vs MCF5270AB100 Comparison
Detailed side-by-side comparison of MCF5271CAB100 by NXP Semiconductors and MCF5270AB100 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP
MCF5271CAB100 ⚠ Last Time BuySpecification Comparison
| Parameter | MCF5271CAB100 | MCF5270AB100 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | Active |
| Core Architecture | ColdFire V2 | ColdFire V2 (32-bit RISC) |
| Data Bus Width | 32-bit | — |
| Maximum Clock Frequency | 100 MHz | 100 MHz |
| On-chip SRAM | 64 KB | 64 KB |
| On-chip ROM | ROMless (0 KB) | — |
| Supply Voltage | 3.3 V | [DATA_NEEDED: core and I/O voltage] |
| Package Type | QFP-160 (28x28 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Ethernet MAC | 10/100 Mbit/s with MII | Integrated Fast Ethernet (MII/RMII) |
| CAN Controllers | 2x CAN 2.0B | — |
| USB Interface | USB 1.1 Device | — |
| UART Count | 3 | [DATA_NEEDED: UART count] |
| I2C | Yes | — |
| ADC | 10-bit, 8-channel | — |
| External Memory Bus | 32-bit SDRAM/SRAM/Flash controller | — |
| Debug Interface | JTAG / BDM | — |
| Operating Temperature | -40C to +85C | 0C to +105C |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Process Node | 130 nm | — |
| EMAC Engine | Yes (Hardware Multiply-Accumulate) | — |
| Program Memory | — | ROMless (external) |
| Package | — | 160-QFP (28x28 mm) |
| USB Controller | — | Integrated USB 1.1 |
| DMA Channels | — | [DATA_NEEDED: DMA channel count] |
| Timers | — | [DATA_NEEDED: timer count] |
| JTAG Debug | — | Yes (Boundary Scan + BDM) |