MPC8314ECVRAFDA vs MPC8314CVRAGDA Comparison
Detailed side-by-side comparison of MPC8314ECVRAFDA by NXP Semiconductors and MPC8314CVRAGDA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP
MPC8314ECVRAFDA ✓ ActiveNXP Semiconductors
MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA
MPC8314CVRAGDA ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8314ECVRAFDA | MPC8314CVRAGDA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.40 | $19.20 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Type | PowerQUICC II Pro Communications Processor | — |
| Core Architecture | Power Architecture e300c3 | PowerPC e300c3 |
| Data Bus Width | 32-bit | 32 bit |
| Maximum CPU Clock Frequency | 333 MHz | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | DDR1 and DDR2 SDRAM | DDR1/DDR2, 32-bit |
| Gigabit Ethernet MACs | 2 (RGMII, MII/RGMII) | — |
| PCI Interface | 32-bit PCI v2.3 + PCI Express | PCI v2.3, 32-bit, up to 66 MHz |
| USB Interface | USB 2.0 Full-Speed / Low-Speed | — |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| TDM Interface | Yes (TDM) | TDM (T1/E1) |
| Operating Temperature Range | -40C to +105C (junction) | — |
| Package | 620-HBGA (29x29 mm) | 620-HBGA (HCTE-BGA, 29x29 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount, 1.0 mm ball pitch |
| Silicon Revision | Rev 1 | — |
| RoHS Status | See _validation_note | Compliant |
| Core Count | — | 1 |
| Maximum Clock Frequency | — | 400 MHz |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| Ethernet | — | 2x 10/100/1000 Mbps GMII / RGMII |
| USB | — | USB 2.0 (Host/Device/OTG) |
| Encryption Engine | — | Not present (C-variant, non-encrypt) |
| Process Technology | — | 90 nm CMOS |
| Operating Temperature | — | -40C to +105C |
| Supply Voltage | — | Core 1.0 V, I/O 3.3 V (typical) |
| MSL Level | — | 3 (per JEDEC J-STD-020) |