MPC8314ECVRAFDA vs MPC8314CVRAGDA 对比

详细并排对比 MPC8314ECVRAFDA 出自 NXP Semiconductors 和 MPC8314CVRAGDA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8314ECVRAFDA MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP

MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP

MPC8314ECVRAFDA ✓ 量产中
NXP Semiconductors
MPC8314CVRAGDA MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA

MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA

MPC8314CVRAGDA ⚠ 最后一次采购

规格对比

参数 MPC8314ECVRAFDA MPC8314CVRAGDA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $25.40 $19.20
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type PowerQUICC II Pro Communications Processor —
Core Architecture Power Architecture e300c3 PowerPC e300c3
数据总线宽度 32-bit 32 bit
Maximum CPU Clock Frequency 333 MHz —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Memory Controller DDR1 and DDR2 SDRAM DDR1/DDR2, 32-bit
Gigabit Ethernet MACs 2 (RGMII, MII/RGMII) —
PCI Interface 32-bit PCI v2.3 + PCI Express PCI v2.3, 32-bit, up to 66 MHz
USB Interface USB 2.0 Full-Speed / Low-Speed —
Security Engine SEC 2.0 (DES/3DES/AES/SHA) —
TDM Interface Yes (TDM) TDM (T1/E1)
工作温度范围 -40C to +105C (junction) —
封装 620-HBGA (29x29 mm) 620-HBGA (HCTE-BGA, 29x29 mm)
安装类型 Surface Mount (BGA) Surface Mount, 1.0 mm ball pitch
Silicon Revision Rev 1 —
RoHS 状态 See _validation_note Compliant
Core Count — 1
最大时钟频率 — 400 MHz
Instruction Cache — 16 KB
Data Cache — 16 KB
Ethernet — 2x 10/100/1000 Mbps GMII / RGMII
USB — USB 2.0 (Host/Device/OTG)
Encryption Engine — Not present (C-variant, non-encrypt)
Process Technology — 90 nm CMOS
工作温度 — -40C to +105C
电源电压 — Core 1.0 V, I/O 3.3 V (typical)
MSL 等级 — 3 (per JEDEC J-STD-020)

数据手册与资源

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