MPC8360ECVVAGDGA vs MPC8360ECVVAJDGA Comparison
Detailed side-by-side comparison of MPC8360ECVVAGDGA by NXP Semiconductors and MPC8360ECVVAJDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ ActiveNXP Semiconductors
MPC8360ECVVAJDGA - PowerQUICC II Pro SoC, 533MHz | NXP
MPC8360ECVVAJDGA ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8360ECVVAGDGA | MPC8360ECVVAJDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Last Time Buy |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | MPC83xx PowerQUICC II Pro (e300 core) |
| Core Architecture | Power Architecture (PowerPC), 32-bit | Power Architecture, 32-bit |
| Number of Cores | 1 | 1 |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | — |
| USB Interface | USB 2.0 Full-Speed | — |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | SEC 2.x (cryptographic accelerator) |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| Operating Temperature Range | -40C to +105C | — |
| Package | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | Rev 1 |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Core Frequency | — | 533 MHz |
| Bit Width | — | 32-bit |
| Supply Voltage | — | 1.2 V core |
| Memory Interface | — | DDR1/DDR2 SDRAM controller |
| Ethernet | — | 10/100/1000 (1 GbE) |
| PCI | — | PCI 2.2 interface |
| USB | — | USB 2.0 |
| TDM / ATM | — | Yes |
| Operating Temperature | — | -40 °C to +105 °C |
| Packaging Type | — | Tray |
| Lead Free | — | Yes |
| RoHS | — | Compliant per NXP product page |