MPC8360ECVVAGDGA vs MPC8360ECVVAJDGA 비교
다음의 상세 나란히 비교: MPC8360ECVVAGDGA 제조: NXP Semiconductors 및 MPC8360ECVVAJDGA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ 활성사양 비교
| 파라미터 | MPC8360ECVVAGDGA | MPC8360ECVVAJDGA |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 최종 구매 |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | MPC83xx PowerQUICC II Pro (e300 core) |
| Core Architecture | Power Architecture (PowerPC), 32-bit | Power Architecture, 32-bit |
| Number of Cores | 1 | 1 |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | — |
| USB Interface | USB 2.0 Full-Speed | — |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | SEC 2.x (cryptographic accelerator) |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| 동작 온도 범위 | -40C to +105C | — |
| 패키지 | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | Rev 1 |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Core Frequency | — | 533 MHz |
| Bit Width | — | 32-bit |
| 공급 전압 | — | 1.2 V core |
| Memory Interface | — | DDR1/DDR2 SDRAM controller |
| Ethernet | — | 10/100/1000 (1 GbE) |
| PCI | — | PCI 2.2 interface |
| USB | — | USB 2.0 |
| TDM / ATM | — | Yes |
| 동작 온도 | — | -40 °C to +105 °C |
| Packaging Type | — | Tray |
| Lead Free | — | Yes |
| RoHS | — | Compliant per NXP product page |