MPC8360VVAGDGA vs MPC8360EZUAJDGA Comparison

Detailed side-by-side comparison of MPC8360VVAGDGA by NXP Semiconductors and MPC8360EZUAJDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8360VVAGDGA MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA ✗ End of Life
NXP Semiconductors
MPC8360EZUAJDGA MPC8360EZUAJDGA - 533MHz PowerQUICC II Pro MPU, TBGA-740 | NXP

MPC8360EZUAJDGA - 533MHz PowerQUICC II Pro MPU, TBGA-740 | NXP

MPC8360EZUAJDGA ✗ End of Life

Specification Comparison

Parameter MPC8360VVAGDGA MPC8360EZUAJDGA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life End of Life
Core Architecture PowerPC e300 (Power Architecture technology) —
Core Frequency 400 MHz 533 MHz
Number of Cores 1 —
Data Bus Width 32-bit 32-bit
Series MPC83xx (PowerQUICC II Pro) —
Core Supply Voltage (Vcore) 1.2 V —
I/O Supply Voltage 1.8 / 2.5 / 3.3 V 1.8 V / 2.5 V / 3.3 V
Operating Temperature Range 0C to +105C —
Package 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) —
Mounting Type Surface Mount —
Memory Interface DDR1 / DDR2 memory controller —
PCI Interface 32-bit PCI v2.3 —
Ethernet 1 x 10/100/1000 Mbps MAC (RGMII) 1 Gbit Ethernet (tri-speed MACs, SGMII)
USB 1 x USB 2.0 (host/device) USB 2.0 Full-Speed
Communications Engine QUICC Engine (HDLC / ATM / TDM) —
Serial Interfaces UART, I2C, SPI, TDM —
Lead Free / RoHS No-Pb (non-ENC, NO-PB variant per Mouser listing) —
Architecture — Power Architecture (e300 core), RISC
Supply Voltage (Core) — 1.2 V
Package Type — TBGA (LBGA), 37.50 x 37.50 mm, 1.46 mm height
Pin/Ball Count — 740
Ball Pitch — 1.0 mm
Operating Temperature — 0 °C to +105 °C
Memory Controller — DDR1 / DDR2 with ECC
PCI — PCI 2.2 (32-bit, 66 MHz)
Communications Acceleration — QUICC Engine (TDM, ATM, Ethernet, MPLS)
Security Engine — SEC 2.0+ (IPsec, crypto accelerators)
Process Technology — 0.13 um CMOS
JESD-609 Code — e0
Lead Free — Yes (TBGA, lead-free)

Datasheets & Resources

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