MPC8360VVAGDGA vs MPC8360EZUAJDGA 对比
详细并排对比 MPC8360VVAGDGA 出自 NXP Semiconductors 和 MPC8360EZUAJDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8360EZUAJDGA - 533MHz PowerQUICC II Pro MPU, TBGA-740 | NXP
MPC8360EZUAJDGA ✗ 停产规格对比
| 参数 | MPC8360VVAGDGA | MPC8360EZUAJDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 停产 |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | 533 MHz |
| Number of Cores | 1 | — |
| 数据总线宽度 | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | — |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| 工作温度范围 | 0C to +105C | — |
| 封装 | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | — |
| 安装类型 | Surface Mount | — |
| Memory Interface | DDR1 / DDR2 memory controller | — |
| PCI Interface | 32-bit PCI v2.3 | — |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1 Gbit Ethernet (tri-speed MACs, SGMII) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 Full-Speed |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Architecture | — | Power Architecture (e300 core), RISC |
| Supply Voltage (Core) | — | 1.2 V |
| Package Type | — | TBGA (LBGA), 37.50 x 37.50 mm, 1.46 mm height |
| Pin/Ball Count | — | 740 |
| Ball Pitch | — | 1.0 mm |
| 工作温度 | — | 0 °C to +105 °C |
| Memory Controller | — | DDR1 / DDR2 with ECC |
| PCI | — | PCI 2.2 (32-bit, 66 MHz) |
| Communications Acceleration | — | QUICC Engine (TDM, ATM, Ethernet, MPLS) |
| Security Engine | — | SEC 2.0+ (IPsec, crypto accelerators) |
| Process Technology | — | 0.13 um CMOS |
| JESD-609 Code | — | e0 |
| Lead Free | — | Yes (TBGA, lead-free) |