MPC8555PXALF vs MPC8555EVTAPF Comparison

Detailed side-by-side comparison of MPC8555PXALF by NXP Semiconductors and MPC8555EVTAPF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8555PXALF MPC8555PXALF - PowerQUICC III 667MHz MPU, 783-FCPBGA | NXP

MPC8555PXALF - PowerQUICC III 667MHz MPU, 783-FCPBGA | NXP

MPC8555PXALF Nrnd
NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ Last Time Buy

Specification Comparison

Parameter MPC8555PXALF MPC8555EVTAPF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Last Time Buy
Core Architecture PowerPC e500 PowerPC e500
Core Count 1 1
Data Bus Width 32-bit 32 bit
Maximum Clock Frequency 667 MHz 833 MHz
Supply Voltage (Core) 1.2 V —
Supply Voltage (I/O) 2.5 V / 3.3 V —
Package Type FCBGA-783 (Flip-Chip BGA) —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Package Height 3.75 mm —
Pin Count 783 —
Mounting Type Surface Mount (Flip Chip) Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] -40C to +105C (industrial extended)
Memory Controller Dual DDR SDRAM 32-bit DDR with ECC, up to DDR-333
Ethernet Dual Gigabit Ethernet MAC 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI)
PCI Interface 32-bit PCI / PCI-X 2 x PCI 2.2 (32-bit, 66 MHz)
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Series — PowerQUICC III (MPC85xx)
Package — 783-FCPBGA (29 x 29 mm)
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 256 KB integrated
Security Engine — IPSec / SSL / TLS / bulk crypto acceleration
Supply Voltage — 1.0 V core, 3.3 V I/O (typical)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

Browse All Products Create BOM Request Quote