MPC8555PXALF vs MPC8555EVTAPF 对比

详细并排对比 MPC8555PXALF 出自 NXP Semiconductors 和 MPC8555EVTAPF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8555PXALF MPC8555PXALF - PowerQUICC III 667MHz MPU, 783-FCPBGA | NXP

MPC8555PXALF - PowerQUICC III 667MHz MPU, 783-FCPBGA | NXP

MPC8555PXALF Nrnd
NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ 最后一次采购

规格对比

参数 MPC8555PXALF MPC8555EVTAPF
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 最后采购期
Core Architecture PowerPC e500 PowerPC e500
Core Count 1 1
数据总线宽度 32-bit 32 bit
最大时钟频率 667 MHz 833 MHz
Supply Voltage (Core) 1.2 V —
Supply Voltage (I/O) 2.5 V / 3.3 V —
Package Type FCBGA-783 (Flip-Chip BGA) —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Package Height 3.75 mm —
引脚数量 783 —
安装类型 Surface Mount (Flip Chip) Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] -40C to +105C (industrial extended)
Memory Controller Dual DDR SDRAM 32-bit DDR with ECC, up to DDR-333
Ethernet Dual Gigabit Ethernet MAC 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI)
PCI Interface 32-bit PCI / PCI-X 2 x PCI 2.2 (32-bit, 66 MHz)
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Series — PowerQUICC III (MPC85xx)
封装 — 783-FCPBGA (29 x 29 mm)
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 256 KB integrated
Security Engine — IPSec / SSL / TLS / bulk crypto acceleration
电源电压 — 1.0 V core, 3.3 V I/O (typical)
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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