MPC8555VTAPF vs MPC8543VTANGD Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8555VTAPF tarafından NXP Semiconductors ve MPC8543VTANGD tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA
MPC8555VTAPF ✗ Son Kullanım Zamanı
Özellik Karşılaştırması
| Parametre | MPC8555VTAPF | MPC8543VTANGD |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Hayat Dönemi Sonu | Aktif |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | — |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | — |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| İşletim Sıcaklığı | -40C to +105C (Industrial / Extended) | 0 °C to +105 °C |
| Paket | 783-FCPBGA, 29x29 mm | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (BGA) |
| Part Status | Not For New Designs | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (Freescale) |
| Series | — | PowerQUICC III |
| Core Architecture | — | Power Architecture, 7-stage pipeline, dual-issue superscalar |
| Core Speed | — | 800 MHz |
| Bus Width | — | 32-bit |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 256 KB |
| Memory Controller | — | DDR2 SDRAM with ECC, up to 533 MHz data rate |
| Ethernet MACs | — | 4x Gigabit (SGMII/RGMII) |
| PCI Express | — | 2x PCIe interfaces |
| Serial RapidIO | — | 2x SRIO endpoints |
| PCI/PCI-X | — | 1x 32-bit PCI/PCI-X interface |
| Core Voltage | — | 1.0 V (typical) |
| I/O Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 90 nm CMOS |
| Package Type | — | FCBGA-783 (29x29 mm) |