MPC860DEZQ50D4 vs MPC860SRVR50D4R2 Comparison

Detailed side-by-side comparison of MPC860DEZQ50D4 by NXP Semiconductors and MPC860SRVR50D4R2 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860DEZQ50D4 MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 Nrnd
NXP Semiconductors
MPC860SRVR50D4R2 MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 ⚠ Last Time Buy

Specification Comparison

Parameter MPC860DEZQ50D4 MPC860SRVR50D4R2
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $24.95 $85.75
Processor Type MPC8xx PowerQUICC, 32-bit MPC8xx PowerQUICC, 32-Bit Power Architecture
Core Architecture Power Architecture (embedded) —
Core Frequency 50 MHz —
Communications Processor Module CPM with HDLC, Ethernet, PCMCIA, SCC Yes (RISC CPM with HDLC, Ethernet, UART)
Ethernet MAC 10/100 Mbps integrated —
HDLC/SDLC Channels Yes (multi-channel) —
PCMCIA Interface Yes —
Supply Voltage (I/O) 3.3 V —
Package 357-Ball PBGA (25x25 mm) 357-BGA (25 x 25 mm)
Mounting Type Surface Mount (BGA) Surface Mount
Operating Temperature 0 C to +95 C —
RoHS Status Contains Lead (legacy BGA) Compliant
Lead-Free Status Contains Lead —
Packaging Tray Tape & Reel (TR)
Sub-Brand Heritage Freescale / NXP PowerQUICC —
Core Count — 1
Maximum Clock Frequency — 50 MHz
Operating Voltage — 3.3 V
Operating Temperature Range — 0 C to +95 C
Lead Free Status — Lead Free
Process Technology — 0.32 um CMOS
Ethernet Interfaces — 10/100 Mbps Fast Ethernet (FCC)
DMA Channels — 4
Series — MPC860

Datasheets & Resources

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