MPC860DEZQ50D4 vs MPC860SRVR50D4R2 Vergleich
Detaillierter Direktvergleich von MPC860DEZQ50D4 von NXP Semiconductors und MPC860SRVR50D4R2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP
MPC860SRVR50D4R2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC860DEZQ50D4 | MPC860SRVR50D4R2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,95 | $85,75 |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC, 32-Bit Power Architecture |
| Core Architecture | Power Architecture (embedded) | — |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | Yes (RISC CPM with HDLC, Ethernet, UART) |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse | 357-Ball PBGA (25x25 mm) | 357-BGA (25 x 25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Betriebstemperatur | 0 C to +95 C | — |
| RoHS-Status | Contains Lead (legacy BGA) | Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tape & Reel (TR) |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Core Count | — | 1 |
| Maximale Taktfrequenz | — | 50 MHz |
| Operating Voltage | — | 3.3 V |
| Betriebstemperaturbereich | — | 0 C to +95 C |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Ethernet Interfaces | — | 10/100 Mbps Fast Ethernet (FCC) |
| DMA Channels | — | 4 |
| Series | — | MPC860 |